公开(公告)号：US20160212359A1

公开(公告)日：2016-07-21

申请号：US13908495

申请日：2013-06-03

Applicant: SENSORS UNLIMITED, INC.

Inventor： Marc Hansen ,  Jason Bylsma ,  John Tagle ,  Michael Liland, JR.

IPC: H04N5/33 ,  H04N5/232 ,  H01L31/0304 ,  H04N5/225

CPC classification number: H04N5/33 ,  H04N5/2254 ,  H04N5/23209 ,  H04N5/23293

Abstract: Provided is an electromagnetic radiation wavelength conversion module for a SLR camera body. The module can include a housing with a first end that can be releasably coupled to the SLR camera body and a second end that can be releasably coupled to a SLR lens. The module can also include an IR sensor disposed in the housing for converting an infrared radiation signature of an object into at least one digital signal and a display disposed within the module for rendering the at least one digital signal into a visible representation of the of the object that can be detected by a sensor of the SLR camera.

Abstract translation: 提供了一种用于单反相机机身的电磁辐射波长转换模块。 该模块可以包括壳体，该壳体具有可释放地联接到单反相机主体的第一端和可拆卸地联接到单镜反光镜头的第二端。 该模块还可以包括设置在壳体中的IR传感器，用于将物体的红外辐射特征转换为至少一个数字信号，以及布置在模块内的显示器，用于将至少一个数字信号呈现为 可以由单反相机的传感器检测到的物体。

公开(公告)号：US09756273B2

公开(公告)日：2017-09-05

申请号：US14638808

申请日：2015-03-04

Applicant: Sensors Unlimited, Inc.

Inventor： John T. Foster ,  John Tagle ,  Dmitry Zhilinsky ,  Michael A. Liland ,  Laszlo Kovacs ,  Leonardo C. Gonzales

IPC: H04N5/378 ,  H01L23/29 ,  H01L23/556 ,  H01L23/00 ,  H01L27/146 ,  G06T5/40 ,  H04N5/32 ,  H04N5/33

CPC classification number: H04N5/378 ,  G06T5/40 ,  G06T2207/10116 ,  H01L23/291 ,  H01L23/295 ,  H01L23/556 ,  H01L23/57 ,  H01L23/573 ,  H01L27/14618 ,  H01L27/1465 ,  H04N5/32 ,  H04N5/33

Abstract: A multi-tiered approach to combating reverse engineering of electronics is disclosed herein. The encapsulant utilized with the optical sensor may be selected based on being substantially being opaque to X-ray inspection. In this way, visible public inspection to gain competitive intelligence may be reduced and operation of the electronics may remain unaffected. Additionally, a thin filament of wire embedded just below the surface of the encapsulant could be used as an electronic tripwire in response to being severed and/or dissolved by the reverse engineering strong solvents and acids.

公开(公告)号：US20140312450A1

公开(公告)日：2014-10-23

申请号：US14198923

申请日：2014-03-06

Applicant: Sensors Unlimited, Inc.

Inventor： John Tagle ,  Dmitry Zhilinsky ,  Michael Liland, JR.

IPC: H01L27/146

CPC classification number: H01L27/1469 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A method and structure of an image sensor device including a read out integrated circuit (ROIC) and a photodiode array (PDA). An embodiment may include a package substrate having a recess and a raised pedestal within the recess; a read out integrated circuit (ROIC) physically attached to the raised pedestal; a photodiode array (PDA) physically attached to the ROIC and electrically coupled therewith; and a printed circuit board (PCB) within the recess in the package substrate, wherein the PCB has an opening therein and the raised pedestal at least partially extends through the opening in the PCB.

Abstract translation: 包括读出集成电路（ROIC）和光电二极管阵列（PDA）的图像传感器装置的方法和结构。 实施例可以包括在凹部内具有凹部和凸起的基座的封装基板; 读出的集成电路（ROIC）物理地连接到凸起的基座上; 物理地连接到ROIC并与其电耦合的光电二极管阵列（PDA）; 以及印刷电路板（PCB），其位于所述封装衬底的所述凹部内，其中所述PCB在其中具有开口，并且所述升高的基座至少部分延伸穿过所述PCB中的所述开口。

公开(公告)号：US20160291283A1

公开(公告)日：2016-10-06

申请号：US14676295

申请日：2015-04-01

Applicant: Sensors Unlimited, Inc.

Inventor： John Tagle ,  John T. Foster ,  Robert Winkler ,  Gustavo A. Balcazar

IPC: G02B7/02 ,  G02B7/04

CPC classification number: G02B7/028 ,  G02B7/10

Abstract: A lens housing includes a main housing, a lens array, a lens housing, and an athermalization bushing. The lens array has a thermally variable focal length that determines a focal point along a focal axis. The lens housing contains the lens array and is situated within the main housing, and is capable of translating relative to the main housing along the focal axis. The athermalization bushing is situated axially between the lens housing and the main housing, such that thermal expansion of the athermalization bushing translates the lens housing along the focal axis. This translation causes the focal point to remain substantially fixed relative to the main housing as the focal length of the lens array varies across an operational temperature range.

Abstract translation: 透镜壳体包括主壳体，透镜阵列，透镜壳体和绝热衬套。 透镜阵列具有可变焦距，其确定沿着焦点轴的焦点。 透镜壳体包含透镜阵列并且位于主壳体内，并且能够沿着焦点相对于主壳体平移。 绝热衬套轴向位于透镜壳体和主壳体之间，使得无热绝缘衬套的热膨胀使透镜壳体沿着焦点轴线平移。 当透镜阵列的焦距在工作温度范围内变化时，该平移使得焦点相对于主壳体保持基本固定。

公开(公告)号：US20160261812A1

公开(公告)日：2016-09-08

申请号：US14638808

申请日：2015-03-04

Applicant: Sensors Unlimited, Inc.

Inventor： John T. Foster ,  John Tagle ,  Dmitry Zhilinsky ,  Michael A. Liland ,  Laszlo Kovacs ,  Leonardo C. Gonzales

IPC: H04N5/378 ,  H01L23/00 ,  H04N5/33 ,  G06T5/40 ,  H04N5/32 ,  H01L27/146 ,  H01L23/29

CPC classification number: H04N5/378 ,  G06T5/40 ,  G06T2207/10116 ,  H01L23/291 ,  H01L23/295 ,  H01L23/556 ,  H01L23/57 ,  H01L23/573 ,  H01L27/14618 ,  H01L27/1465 ,  H04N5/32 ,  H04N5/33

Abstract: A multi-tiered approach to combating reverse engineering of electronics is disclosed herein. The encapsulant utilized with the optical sensor may be selected based on being substantially being opaque to X-ray inspection. In this way, visible public inspection to gain competitive intelligence may be reduced and operation of the electronics may remain unaffected. Additionally, a thin filament of wire embedded just below the surface of the encapsulant could be used as an electronic tripwire in response to being severed and/or dissolved by the reverse engineering strong solvents and acids.

Abstract translation: 本文公开了一种防止电子逆向工程的多层次方法。 可以基于对X射线检查基本上不透明来选择与光学传感器一起使用的密封剂。 以这种方式，可以减少获得竞争情报的明显的公众检查，并且电子设备的操作可能不受影响。 此外，恰好在密封剂表面下方嵌入的细丝细丝可以用作电子绊线，以响应于被逆向工程的强溶剂和酸分解和/或溶解。