公开(公告)号：US20100142018A1

公开(公告)日：2010-06-10

申请号：US12572822

申请日：2009-10-02

Applicant: Seong-Ho SHIN

Inventor： Seong-Ho SHIN

IPC: G02B26/10

CPC classification number: G02B26/127 ,  G02B26/085 ,  G02B26/105 ,  H04N1/053 ,  H04N1/1135 ,  H04N1/12 ,  H04N2201/02439 ,  H04N2201/0468 ,  H04N2201/0471 ,  H04N2201/04732 ,  H04N2201/04744 ,  H04N2201/04748 ,  H04N2201/04755 ,  H04N2201/04794

Abstract: Disclosed are a light scanning unit and a method of synchronizing the scanning operation of such light scanning unit. The light scanning unit includes a deflection, mirror that is driven to oscillate so as to deflect and scan a light beam in a bidirectional scanning path. The synchronization, of a scanning operation may be made at least in part in consideration of the direction of flow of the current that is supplied to drive the deflection mirror to oscillate.

Abstract translation: 公开了一种光扫描单元和使这种光扫描单元的扫描操作同步的方法。 光扫描单元包括偏转镜，其被驱动以振荡以便在双向扫描路径中偏转和扫描光束。 扫描操作的同步可以至少部分地考虑供应以驱动偏转镜振荡的电流的流动方向。

公开(公告)号：US20160172286A1

公开(公告)日：2016-06-16

申请号：US14746247

申请日：2015-06-22

Applicant: Jin-Kyung KIM ,  Yong-hoon KIM ,  Seong-Ho SHIN

Inventor： Jin-Kyung KIM ,  Yong-hoon KIM ,  Seong-Ho SHIN

IPC: H01L23/498 ,  H05K1/18

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49838 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/181 ,  H05K2201/09218 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Semiconductor packages, module substrates and semiconductor package modules having the same are provided. The semiconductor package module includes a module substrate provided with a plurality of signal wires on an upper surface thereof, a package substrate disposed on the module substrate, a semiconductor chip disposed on one surface of the package substrate, and a plurality of external connection terminals disposed on another surface of the package substrate.

Abstract translation: 提供半导体封装，模块基板和具有该半导体封装的半导体封装模块。 半导体封装模块包括在其上表面上设置有多个信号线的模块基板，设置在模块基板上的封装基板，设置在封装基板的一个表面上的半导体芯片，以及设置在多个外部连接端子 在封装衬底的另一个表面上。