公开(公告)号：US09608502B2

公开(公告)日：2017-03-28

申请号：US14348875

申请日：2013-05-27

Applicant: Seong-Ho Shin

Inventor： Seong-Ho Shin

IPC: A63F13/10 ,  H02K33/02 ,  A63F13/285 ,  G08B6/00 ,  H02K7/06 ,  H02K13/00 ,  H02K33/16

CPC classification number: H02K33/02 ,  A63F13/285 ,  G08B6/00 ,  H02K7/06 ,  H02K13/006 ,  H02K33/16

Abstract: An impactive vibration generating apparatus includes a rotary unit having a shaft and a coil arranged around the shaft; a fixing unit surrounding the rotary unit and having a magnet therein; a commutator arranged along the circumference of the shaft connected to the coil; a pair of brushes to slidably contacting the commutator; a protrusion attached to one part of the rotary unit; and a stopper contacting the protrusion when the rotary unit rotates so as to interrupt the rotation of the rotary unit. According to the impactive vibration generating apparatus, a sharp and strong single impactive vibration or only a few impactive vibrations can be generated. Further, a strong vibration can be caused by continuous impactive vibrations, and the frequency or cycle of the generation of the impactive vibrations can be adjusted.

公开(公告)号：US20120139090A1

公开(公告)日：2012-06-07

申请号：US13243704

申请日：2011-09-23

Applicant: Yong-Hoon Kim ,  Hee-Seok Lee ,  Seong-Ho Shin ,  Se-Ho You ,  Yun-Hee Lee

Inventor： Yong-Hoon Kim ,  Hee-Seok Lee ,  Seong-Ho Shin ,  Se-Ho You ,  Yun-Hee Lee

IPC: H01L23/552

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L23/5226 ,  H01L23/552 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.

Abstract translation: 提供堆叠的包装结构。 堆叠封装结构包括：堆叠封装，包括下半导体封装，设置在下半导体封装上并与下半导体封装隔开预定距离的上半导体封装;电连接下半导体封装和 上部半导体封装，同时支撑它们之间的空间，以及绝缘层，其至少设置在所述封装间连接部分的外部并填充所述下部半导体封装和所述上部半导体封装之间的空间，以及围绕所述下部半导体封装的横向和顶部表面的电磁屏蔽层 堆叠包装。

公开(公告)号：US20150236576A1

公开(公告)日：2015-08-20

申请号：US14348875

申请日：2013-05-27

Applicant: Seong-Ho SHIN

Inventor： Seong-Ho Shin

IPC: H02K33/02 ,  G08B6/00 ,  A63F13/285 ,  H02K7/06 ,  H02K13/00

CPC classification number: H02K33/02 ,  A63F13/285 ,  G08B6/00 ,  H02K7/06 ,  H02K13/006 ,  H02K33/16

Abstract: An impactive vibration generating apparatus of the present invention comprises: a rotary unit having a shaft, and a coil arranged around the shaft so as to rotate together with the shaft; a fixing unit which surrounds the rotary unit, and inside which a magnet is installed; a commutator which is arranged along the circumference of the shaft and coaxially to the shaft, and which is connected to the coil; at least one pair of brushes to slidably contacting the commutator; a protrusion attached to one part of the rotary unit so as to rotate together with the rotary unit; and a stopper contacting the protrusion when the rotary unit rotates so as to interrupt the rotation of the rotary unit. Further, the application apparatus of the present invention comprises: input/output unit; a control unit for controlling the state of the input/output unit of the apparatus, the impactive vibration generating apparatus operating in accordance with the signal from the control unit. According to the impactive vibration generating apparatus of the present invention, a sharp and strong impactive vibration can be generated, and a single impactive vibration or only a few impactive vibrations can be generated. Further, a strong vibration can be caused by continuous impactive vibrations, and the frequency or cycle of the generation of the impactive vibrations can be adjusted. Thus, the apparatus of the present invention enables communication or signal transmission to be performed in a game console, a portable terminal such as a mobile phone, or a multimedia player.

Abstract translation: 本发明的冲击振动发生装置包括：具有轴的旋转单元和围绕所述轴布置以与所述轴一起旋转的线圈; 固定单元，其围绕所述旋转单元，并且其内部安装有磁体; 换向器，其沿着所述轴的圆周布置并与所述轴同轴并且连接到所述线圈; 至少一对可滑动地接触换向器的刷子; 安装在所述旋转单元的一部分上以与所述旋转单元一起旋转的突起; 以及当所述旋转单元旋转时阻止所述突起接触以阻止所述旋转单元的旋转。 此外，本发明的应用装置包括：输入/输出单元; 用于控制装置的输入/输出单元的状态的控制单元，所述冲击振动发生装置根据来自所述控制单元的信号进行操作。 根据本发明的冲击振动发生装置，可以产生剧烈且强烈的冲击振动，并且可以产生单个冲击振动或仅产生少量冲击振动。 此外，可能由连续的冲击振动引起强烈的振动，并且可以调节产生冲击振动的频率或周期。 因此，本发明的装置能够在游戏机，移动电话等便携式终端或多媒体播放器中进行通信或信号传输。

公开(公告)号：US08680667B2

公开(公告)日：2014-03-25

申请号：US13400035

申请日：2012-02-17

Applicant: Heung-Kyu Kwon ,  Seong-Ho Shin ,  Yun-Seok Choi ,  Yong-Hoon Kim

Inventor： Heung-Kyu Kwon ,  Seong-Ho Shin ,  Yun-Seok Choi ,  Yong-Hoon Kim

IPC: H01L23/02

CPC classification number: H01L24/06 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package stack structure may an upper package include an upper package substrate having a first edge and a second edge opposite to the first edge. The upper package substrate has a first region arranged near the first edge and a second region arranged near the second edge. A first upper semiconductor device is mounted on the upper package substrate. The package stack structure may also include a lower package having a lower package substrate and a lower semiconductor device. The lower package is connected to the upper package through a plurality of inter-package connectors. The plurality of the inter-package connectors may include first inter-package connectors configured to transmit data signals; second inter-package connectors configured to transmit address/control signals; third inter-package connectors configured to provide a supply voltage for an address/control circuit; and fourth inter-package connectors configured to provide a supply voltage for a data circuit.

Abstract translation: 封装堆叠结构可以是上封装包括具有第一边缘和与第一边缘相对的第二边缘的上封装基板。 上封装衬底具有布置在第一边缘附近的第一区域和布置在第二边缘附近的第二区域。 第一上半导体器件安装在上封装衬底上。 封装堆叠结构还可以包括具有下封装衬底和下半导体器件的下封装。 下封装通过多个封装间连接器连接到上封装。 多个包装间连接器可以包括被配置为传送数据信号的第一包装间连接器; 配置成发送地址/控制信号的第二串联连接器连接器; 第三组件间连接器，被配置为提供地址/控制电路的电源电压; 以及被配置为提供数据电路的电源电压的第四组件间连接器。

公开(公告)号：US08404449B2

公开(公告)日：2013-03-26

申请号：US12429897

申请日：2009-04-24

Applicant: Hagan Bayley ,  Seong-Ho Shin ,  Tudor Luchian ,  Stephen Cheley

Inventor： Hagan Bayley ,  Seong-Ho Shin ,  Tudor Luchian ,  Stephen Cheley

IPC: G01N33/53

CPC classification number: G01N33/5308 ,  C12Q1/001 ,  G01N33/5438 ,  G01N33/6872

Abstract: A system and method for stochastic sensing in which the analyte covalently bonds to the sensor element or an adaptor element. If such bonding is irreversible, the bond may be broken by a chemical reagent. The sensor element may be a protein, such as the engineered PSH type or αHL protein pore. The analyte may be any reactive analyte, including chemical weapons, environmental toxins and pharmaceuticals. The analyte covalently bonds to the sensor element to produce a detectable signal. Possible signals include change in electrical current, change in force, and change in fluorescence. Detection of the signal allows identification of the analyte and determination of its concentration in a sample solution. Multiple analytes present in the same solution may be detected.

Abstract translation: 用于随机感测的系统和方法，其中分析物共价键合到传感器元件或适配器元件。 如果这种键合是不可逆的，则该键可能被化学试剂破坏。 传感器元件可以是蛋白质，例如工程化的PSH型或αHL蛋白质孔。 分析物可以是任何反应性分析物，包括化学武器，环境毒素和药物。 分析物共价键合到传感器元件以产生可检测的信号。 可能的信号包括电流的变化，力的变化和荧光的变化。 信号的检测允许鉴定分析物并确定其在样品溶液中的浓度。 可以检测存在于相同溶液中的多种分析物。

公开(公告)号：US09142478B2

公开(公告)日：2015-09-22

申请号：US14102430

申请日：2013-12-10

Applicant: Yong-Hoon Kim ,  Ji-Chul Kim ,  Seong-Ho Shin ,  In-Ho Choi

Inventor： Yong-Hoon Kim ,  Ji-Chul Kim ,  Seong-Ho Shin ,  In-Ho Choi

IPC: H01L23/367 ,  H01L23/36 ,  H01L23/373 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/36 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/49816 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package stack may include a lower semiconductor package and an upper semiconductor package stacked on a lower package board. The upper semiconductor package may include an upper semiconductor chip mounted on an upper package board with an opening configured to expose a lower surface of the upper semiconductor chip and a first heat slug disposed within the opening, contacting the lower surface of the upper semiconductor chip, and contacting an upper surface of a lower semiconductor chip.

Abstract translation: 半导体封装堆叠可以包括下半导体封装和堆叠在下封装板上的上半导体封装。 上半导体封装可以包括安装在上封装板上的上半导体芯片，其具有用于暴露上半导体芯片的下表面的开口和设置在开口内的第一热芯，接触上半导体芯片的下表面， 并接触下半导体芯片的上表面。

公开(公告)号：US20090283422A1

公开(公告)日：2009-11-19

申请号：US12429897

申请日：2009-04-24

Applicant: Hagan Bayley ,  Seong-Ho Shin ,  Tudor Luchian ,  Stephen Cheley

Inventor： Hagan Bayley ,  Seong-Ho Shin ,  Tudor Luchian ,  Stephen Cheley

IPC: G01N27/26

CPC classification number: G01N33/5308 ,  C12Q1/001 ,  G01N33/5438 ,  G01N33/6872

Abstract: A system and method for stochastic sensing in which the analyte covalently bonds to the sensor element or an adaptor element. If such bonding is irreversible, the bond may be broken by a chemical reagent. The sensor element may be a protein, such as the engineered PSH type or αHL protein pore. The analyte may be any reactive analyte, including chemical weapons, environmental toxins and pharmaceuticals. The analyte covalently bonds to the sensor element to produce a detectable signal. Possible signals include change in electrical current, change in force, and change in fluorescence. Detection of the signal allows identification of the analyte and determination of its concentration in a sample solution. Multiple analytes present in the same solution may be detected.

Abstract translation: 用于随机感测的系统和方法，其中分析物共价键合到传感器元件或适配器元件。 如果这种键合是不可逆的，则该键可能被化学试剂破坏。 传感器元件可以是蛋白质，例如工程化的PSH型或αHL蛋白质孔。 分析物可以是任何反应性分析物，包括化学武器，环境毒素和药物。 分析物共价键合到传感器元件以产生可检测的信号。 可能的信号包括电流的变化，力的变化和荧光的变化。 信号的检测允许鉴定分析物并确定其在样品溶液中的浓度。 可以检测存在于相同溶液中的多种分析物。

公开(公告)号：US09570383B2

公开(公告)日：2017-02-14

申请号：US14746247

申请日：2015-06-22

Applicant: Jin-Kyung Kim ,  Yong-hoon Kim ,  Seong-Ho Shin

Inventor： Jin-Kyung Kim ,  Yong-hoon Kim ,  Seong-Ho Shin

IPC: H01L23/02 ,  H01L23/498 ,  H05K1/18 ,  H01L23/31

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49838 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/181 ,  H05K2201/09218 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Semiconductor packages, module substrates and semiconductor package modules having the same are provided. The semiconductor package module includes a module substrate provided with a plurality of signal wires on an upper surface thereof, a package substrate disposed on the module substrate, a semiconductor chip disposed on one surface of the package substrate, and a plurality of external connection terminals disposed on another surface of the package substrate.

Abstract translation: 提供半导体封装，模块基板和具有该半导体封装的半导体封装模块。 半导体封装模块包括在其上表面上设置有多个信号线的模块基板，设置在模块基板上的封装基板，设置在封装基板的一个表面上的半导体芯片，以及设置在多个外部连接端子 在封装衬底的另一个表面上。

公开(公告)号：US08872319B2

公开(公告)日：2014-10-28

申请号：US13243704

申请日：2011-09-23

Applicant: Yong-Hoon Kim ,  Hee-Seok Lee ,  Seong-Ho Shin ,  Se-Ho You ,  Yun-Hee Lee

Inventor： Yong-Hoon Kim ,  Hee-Seok Lee ,  Seong-Ho Shin ,  Se-Ho You ,  Yun-Hee Lee

IPC: H01L23/02 ,  H01L23/552 ,  H01L25/10 ,  H01L25/16 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L23/5226 ,  H01L23/552 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.

Abstract translation: 提供堆叠的包装结构。 堆叠封装结构包括：堆叠封装，包括下半导体封装，设置在下半导体封装上并与下半导体封装隔开预定距离的上半导体封装;电连接下半导体封装和 上部半导体封装，同时支撑它们之间的空间，以及绝缘层，其至少设置在所述封装间连接部分的外部并填充所述下部半导体封装和所述上部半导体封装之间的空间，以及围绕所述下部半导体封装的横向和顶部表面的电磁屏蔽层 堆叠包装。

公开(公告)号：US08379282B2

公开(公告)日：2013-02-19

申请号：US12572822

申请日：2009-10-02

Applicant: Seong-Ho Shin

Inventor： Seong-Ho Shin

IPC: G02B26/08

CPC classification number: G02B26/127 ,  G02B26/085 ,  G02B26/105 ,  H04N1/053 ,  H04N1/1135 ,  H04N1/12 ,  H04N2201/02439 ,  H04N2201/0468 ,  H04N2201/0471 ,  H04N2201/04732 ,  H04N2201/04744 ,  H04N2201/04748 ,  H04N2201/04755 ,  H04N2201/04794

Abstract: Disclosed are a light scanning unit and a method of synchronizing the scanning operation of such light scanning unit. The light scanning unit includes a deflection mirror that is driven to oscillate so as to deflect and scan a light beam in a bidirectional scanning path. The synchronization of a scanning operation may be made at least in part in consideration of the direction of flow of the current that is supplied to drive the deflection mirror to oscillate.

Abstract translation: 公开了一种光扫描单元和使这种光扫描单元的扫描操作同步的方法。 光扫描单元包括被驱动以振荡以偏转和扫描双向扫描路径中的光束的偏转镜。 扫描操作的同步可以至少部分地考虑供给驱动偏转镜振荡的电流的流动方向。