公开(公告)号：US20170229679A1

公开(公告)日：2017-08-10

申请号：US15498818

申请日：2017-04-27

Applicant: Shanghai Tianma AM-OLED Co., Ltd. ,  Tianma Micro-Electronics Co., Ltd.

Inventor： Yujun LI

IPC: H01L51/56 ,  H01L51/00 ,  H01L51/52

CPC classification number: H01L51/56 ,  H01L25/048 ,  H01L25/105 ,  H01L25/50 ,  H01L27/3244 ,  H01L51/5246 ,  H01L2251/566 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A single display panel and an electronic device are provided. The single display panel comprises an upper substrate; a lower substrate including a display area and a stepped area; and a frame adhesive disposed between the upper substrate and the to a substrate, and surrounding the display area, wherein there is no blank area around the display panel. The single display panel is obtained from an array substrate comprising OLED display panels to be separated from each other through a cutting, wherein the display panel includes a display area, at least two adjacent display panels are connected through the frame adhesive disposed at an edge frame surrounding the display area but not covering the display area, and there is no cutting headroom between at least one side of the at least two adjacent display panels.

公开(公告)号：US20170338297A1

公开(公告)日：2017-11-23

申请号：US15670643

申请日：2017-08-07

Applicant: Shanghai Tianma AM-OLED Co., Ltd.

Inventor： Yujun LI ,  Bengang ZHAO ,  Shucheng LUO ,  Kaen JIANG

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/00 ,  H05B33/10

CPC classification number: H01L27/3283 ,  G02F1/1303 ,  G02F2001/133302 ,  G02F2201/501 ,  G02F2201/56 ,  H01L27/3288 ,  H01L51/0096 ,  H01L51/5212 ,  H05B33/10

Abstract: A display panel and a display panel fabrication method are provided. The display panel comprises a display region; and a peripheral circuit region surrounding the display region. The display panel has a display surface facing viewers and covering the display region and the peripheral circuit region. At least one corner of the display panel is provided with a chamfer having a chamfer surface, the chamfer surface is a new side surface which is going to be introduced to the display panel after the chamfer is formed. A chamfer cutting reflective layer is disposed on the display surface of the display panel and along an edge of the chamfer surface. In a direction perpendicular to a chamfer cutting line and towards the at least one corner of the display panel, a thickness of the chamfer cutting reflective layer is reduced.

公开(公告)号：US20160181230A1

公开(公告)日：2016-06-23

申请号：US14667621

申请日：2015-03-24

Applicant: Shanghai Tianma AM-OLED Co., Ltd. ,  Tianma Micro-Electronics Co., Ltd.

Inventor： Yujun LI

IPC: H01L25/10 ,  H01L51/56 ,  H01L25/00 ,  H01L27/32

CPC classification number: H01L25/105 ,  H01L25/048 ,  H01L25/50 ,  H01L27/3244 ,  H01L51/5246 ,  H01L51/56 ,  H01L2251/566 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An array substrate of organic light-emitting diodes and a method for fabricating the same are provided to narrow an edge frame of product device of organic light-emitting diodes, to shorten the package process time, and to improve the substrate utilization and the production efficiency. The array substrate of organic light-emitting diodes includes a plurality of display panels disposed in an array of rows and columns, wherein at least two adjacent display panels are connected through a frame adhesive, and there is no cutting headroom between at least one side of the at least two adjacent display panels.

Abstract translation: 提供有机发光二极管的阵列基板及其制造方法，以缩小有机发光二极管的产品装置的边框，缩短封装处理时间，提高基板利用率和生产效率 。 有机发光二极管的阵列基板包括以行和列排列的多个显示面板，其中至少两个相邻的显示面板通过框架粘合剂连接，并且在至少一侧的 所述至少两个相邻的显示面板。

公开(公告)号：US20170278831A1

公开(公告)日：2017-09-28

申请号：US15620036

申请日：2017-06-12

Applicant: Shanghai Tianma AM-OLED Co., Ltd. ,  Tianma Micro-Electronics Co., Ltd.

Inventor： Yujun LI

IPC: H01L25/10 ,  H01L51/56 ,  H01L51/52 ,  H01L25/04 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L25/048 ,  H01L25/50 ,  H01L27/3244 ,  H01L51/5246 ,  H01L51/56 ,  H01L2251/566 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An array substrate of organic light-emitting diodes and a method for fabricating the same are provided to narrow an edge frame of product device of organic light-emitting diodes, to shorten the package process time, and to improve the substrate utilization and the production efficiency. The array substrate of organic light-emitting diodes includes a plurality of display panels disposed in an array of rows and columns, wherein at least two adjacent display panels are connected through a frame adhesive, and there is no cutting headroom between at least one side of the at least two adjacent display panels.

公开(公告)号：US20170187007A1

公开(公告)日：2017-06-29

申请号：US15460084

申请日：2017-03-15

Applicant: Shanghai Tianma AM-OLED Co., Ltd. ,  Tianma Micro-electronics Co., Ltd.

Inventor： Yujun LI

IPC: H01L51/56 ,  H01L51/52

CPC classification number: H01L25/105 ,  H01L25/048 ,  H01L25/50 ,  H01L27/3244 ,  H01L51/5246 ,  H01L51/56 ,  H01L2251/566 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An array substrate of organic light-emitting diodes and a method for fabricating the same are provided to narrow an edge frame of product device of organic light-emitting diodes, to shorten the package process time, and to improve the substrate utilization and the production efficiency. The array substrate of organic light-emitting diodes includes a plurality of display panels disposed in an array of rows and columns, wherein at least two adjacent display panels are connected through a frame adhesive, and there is no cutting headroom between at least one side of the at least two adjacent display panels.