公开(公告)号：US5122621A

公开(公告)日：1992-06-16

申请号：US519844

申请日：1990-05-07

Applicant: Meta Rohde ,  Shankar R. Joshi

Inventor： Meta Rohde ,  Shankar R. Joshi

IPC: H01L23/50 ,  H01L23/10 ,  H05K3/34 ,  H05K7/14

CPC classification number: H01L23/10 ,  H01L2924/0002 ,  H05K3/3421 ,  Y10T29/49169 ,  Y10T29/49194 ,  Y10T29/49204

Abstract: A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.

公开(公告)号：US5390349A

公开(公告)日：1995-02-14

申请号：US935549

申请日：1992-08-26

Applicant: Shankar R. Joshi ,  Meta Rohde

Inventor： Shankar R. Joshi ,  Meta Rohde

IPC: H01F19/04 ,  H01F27/02 ,  H04B1/26 ,  H01F27/30 ,  H03B19/16

CPC classification number: H01F27/027 ,  H01F19/04

Abstract: A manner of using a plurality of transformers having cylindrical cores such that operation of the transformers at high frequencies allows the cores of the transformers to be disposed parallel to each other and in relatively close proximity without substantial interference.

Abstract translation: 使用具有圆柱形磁芯的多个变压器的方式，使得变压器在高频下的操作允许变压器的磁芯彼此平行设置并且相对接近而没有实质的干扰。

公开(公告)号：US5805431A

公开(公告)日：1998-09-08

申请号：US588074

申请日：1996-01-17

Applicant: Shankar R. Joshi ,  Meta Rohde

Inventor： Shankar R. Joshi ,  Meta Rohde

IPC: H01F27/29 ,  H05K3/34 ,  H01F27/30 ,  H01F27/04

CPC classification number: H01F27/292 ,  H05K3/3442 ,  H05K2201/09472 ,  Y02P70/613 ,  Y10S439/931

Abstract: A surface mount package particularly suitable for transformers and other components having numerous windings of fragile, difficult to handle wire has a housing which includes openings along the lower edge, the housing being plated with an electrically conductive material on portions of the lower edge and in areas surrounding the opening. A component is held within the housing, and the leads of the component are disposed in the openings at a point above the lower edge of the housing, and the leads are electrically connected to the plating surrounding the openings and the plating at the flat portions of the lower edge. The plating on the flat portions of the lower edge can be at any suitable location, i.e., remote from or adjacent to the openings. Additional components can be stacked on the exterior of the housing, as connected to the plating surrounding the openings. Also, the walls and/or the top of the housing can be plated to provide for versatility in connecting the housed component, or any other components, on and around the housing. The plating on the housing may be connected to the plating surrounding the openings and the plating at the flat portions of the lower edge, or may entirely independent of the housed electronic component.

Abstract translation: 特别适用于具有易碎，难以处理的线的多个绕组的变压器和其它部件的表面安装封装具有壳体，该壳体包括沿着下边缘的开口，该壳体在下边缘的部分和区域中被电镀有导电材料 围绕开幕。 部件被保持在壳体内，并且部件的引线在壳体的下边缘上方的点处设置在开口中，并且引线电连接到围绕开口的电镀和在平坦部分的电镀 下边缘。 在下边缘的平坦部分上的电镀可以在任何合适的位置，即远离或邻近开口。 附加部件可以堆叠在外壳的外部，连接到围绕开口的电镀层。 此外，外壳的壁和/或顶部可以被电镀以提供在壳体上和周围连接容纳部件或任何其它部件的多功能性。 壳体上的电镀可以连接到围绕开口的电镀和在下边缘的平坦部分处的电镀，或者可以完全独立于所容纳的电子部件。

公开(公告)号：US5381084A

公开(公告)日：1995-01-10

申请号：US3114

申请日：1993-01-12

Applicant: Shankar R. Joshi ,  Meta Rohde

Inventor： Shankar R. Joshi ,  Meta Rohde

IPC: H01F19/04 ,  H01F27/02 ,  H01F40/10

CPC classification number: H01F19/04 ,  H01F27/027

Abstract: A mass of dielectric material intimately surrounds a high frequency circuit having plural transformers in relative close proximity to one anther and provides mechanical stability and electrical protection to the circuit. The mass of dielectric material surrounding the circuit has a dielectric constant less than about 2.6 and a loss tangent less than about 0.009.

Abstract translation: 电介质材料质量密集地围绕着具有多个变压器的高频电路，该变压器相对靠近一个电极，并为电路提供了机械稳定性和电气保护。 围绕电路的电介质材料的质量介电常数小于约2.6，损耗角正切小于约0.009。

公开(公告)号：US5160810A

公开(公告)日：1992-11-03

申请号：US823374

申请日：1992-01-21

Applicant: Meta Rohde ,  Shankar R. Joshi

Inventor： Meta Rohde ,  Shankar R. Joshi

IPC: H01L23/10 ,  H05K3/34

CPC classification number: H01L23/10 ,  H01L2924/0002 ,  H05K3/3421

Abstract: A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.

Abstract translation: 密封的表面贴装电子元件封装可以通过转换标准的易于使用的扁平封装来制造。 该封装具有一个底座，一个主传动导线通过该开口延伸，围绕该开口中的传动引线的玻璃 - 金属密封件，并且一次传动引线从该主传动引线延伸，使其与 底部至少与底部的底部齐平。 可以在主传动引线和次传输引线之间设置绝缘体。 一种通过提供具有电介质绝缘体的复合片，用于连接到扁平封装的传输引线的二次传输引线和用于将绝缘体和次级传输引线连接到基座的连接构件来转换标准平板组件的方法 还描述了平板组件。

公开(公告)号：US5416449A

公开(公告)日：1995-05-16

申请号：US247697

申请日：1994-05-23

Applicant: Shankar R. Joshi

Inventor： Shankar R. Joshi

IPC: H03C1/60 ,  H03D7/16 ,  H03D1/24

CPC classification number: H03C1/60 ,  H03D7/165

Abstract: An improved modulator circuit for mixing a modulation signal with a carrier signal includes first and second harmonic mixers which are operative to produce modulated output signals at an output frequency corresponding to both the sum and the difference of the modulation signal frequency and the even harmonic frequencies of the carrier signal frequency. In one configuration employing a 90.degree. hybrid, the output signals of the harmonic mixers are combined to produce a single sideband modulated output signal. A novel harmonic mixer circuit is also provided along with demodulator circuits and methods of modulating and demodulating modulation signals.

Abstract translation: 用于将调制信号与载波信号混合的改进的调制器电路包括第一和第二谐波混频器，其可操作以在对应于调制信号频率和均匀谐波频率的和和的和的和的频率的输出频率产生调制输出信号 载波信号频率。 在使用90°混合的一种配置中，谐波混频器的输出信号被组合以产生单个边带调制的输出信号。 还提供了一种新颖的谐波混频器电路以及解调器电路和调制和解调调制信号的方法。

公开(公告)号：US5650754A

公开(公告)日：1997-07-22

申请号：US389710

申请日：1995-02-15

Applicant: Shankar R. Joshi ,  Ulrich L. Rohde ,  Klaus Eichel

Inventor： Shankar R. Joshi ,  Ulrich L. Rohde ,  Klaus Eichel

IPC: H03B1/00 ,  H03B1/04 ,  H03B5/12 ,  H03J3/18 ,  H03L7/08 ,  H03L7/099 ,  H03L7/183 ,  H03L7/16

CPC classification number: H03L7/183 ,  H03B5/1243 ,  H03J3/185 ,  H03L7/08 ,  H03L7/099 ,  H03B2201/0208 ,  H03B2202/08 ,  H03L2207/06 ,  H03L2207/10

Abstract: Voltage controlled oscillator (VCO) circuits include a VCO and voltage regulator provided on an integrated VCO module, balanced control input for the VCO, buffering of the VCO and frequency multiplication of the VCO output signal. Such improved VCO circuits are especially useful in phase-locked loop (PLL) circuits. Improved PLL circuits are also provided, including a PLL circuit with separate analog and digital grounds.

Abstract translation: 压控振荡器（VCO）电路包括集成VCO模块上的VCO和稳压器，VCO的平衡控制输入，VCO的缓冲和VCO输出信号的倍频。 这种改进的VCO电路在锁相环（PLL）电路中特别有用。 还提供了改进的PLL电路，包括具有独立模拟和数字接地的PLL电路。