公开(公告)号：US20090109636A1

公开(公告)日：2009-04-30

申请号：US12290053

申请日：2008-10-27

Applicant: Shawn Arnold

Inventor： Shawn Arnold

IPC: H05K7/00 ,  H05K3/00

CPC classification number: H01L23/4985 ,  H01L25/0652 ,  H01L2224/16 ,  H05K1/141 ,  H05K1/147 ,  H05K1/148 ,  H05K3/363 ,  H05K3/4691 ,  H05K2201/055 ,  Y10T29/49124

Abstract: A multiple package module and a method of fabricating a multiple package module. The module comprises a central region of a rigid flex circuit board for mounting circuitry, and at least one wing connected by a flexible portion to at least one edge of the central region of the rigid flex circuit board.

Abstract translation: 多封装模块和制造多封装模块的方法。 模块包括用于安装电路的刚性柔性电路板的中心区域，以及至少一个通过柔性部分连接到刚性柔性电路板的中心区域的边缘的翼。

公开(公告)号：US20080047135A1

公开(公告)日：2008-02-28

申请号：US11895922

申请日：2007-08-28

Applicant: Shawn Arnold

Inventor： Shawn Arnold

IPC: H05K3/00

CPC classification number: H05K3/4691 ,  H05K2201/09127 ,  H05K2201/09845 ,  Y10T29/49124

Abstract: A rigid flex circuit board and a method of fabricating a rigid flex circuit board. The method comprising forming a stack of at least two layers of at least one of a flexible material, prepreg material, insulative material, or conductive material over a flexible core to form a structure, wherein the structure comprises a first rigid portion, a second rigid portion, a flexible portion extending between the first and second rigid portions, and a removable rigid portion extending between the first rigid portion and the second rigid portion, processing the structure to form interconnects; and removing the removable rigid portion.

Abstract translation: 刚性柔性电路板和制造刚性柔性电路板的方法。 该方法包括在柔性芯上形成柔性材料，预浸材料，绝缘材料或导电材料中的至少一层至少两层的叠层以形成结构，其中该结构包括第一刚性部分，第二刚性部分 部分，在第一和第二刚性部分之间延伸的柔性部分和在第一刚性部分和第二刚性部分之间延伸的可移除的刚性部分，处理该结构以形成互连; 并移除可拆卸的刚性部分。