公开(公告)号：US11053352B2

公开(公告)日：2021-07-06

申请号：US16523735

申请日：2019-07-26

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbin Chen ,  Qianfa Liu ,  Shanyin Yan ,  Xianping Zeng ,  Cuiming Du

IPC: C08K9/04 ,  C08G65/329 ,  C08F236/06 ,  C08J5/24 ,  C08K3/38 ,  C08K5/14 ,  C08K7/26 ,  C08L53/02 ,  C08F8/02 ,  C08F8/46

Abstract: A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.

公开(公告)号：US11261305B2

公开(公告)日：2022-03-01

申请号：US16523753

申请日：2019-07-26

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbin Chen ,  Qianfa Liu ,  Shanyin Yan ,  Xianping Zeng ,  Cuiming Du

IPC: C08J5/24 ,  B32B15/14 ,  C08L25/10 ,  C08L47/00 ,  C08L71/12 ,  H05K1/03

Abstract: A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.