公开(公告)号：US11584851B2

公开(公告)日：2023-02-21

申请号：US17160011

申请日：2021-01-27

Applicant: Shengyi Technology Co., Ltd.

Inventor： Jianying Shi ,  Weifeng Yin ,  Yongjing Xu ,  Shanyin Yan

IPC: C08L71/12 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  C09D171/12 ,  C09J171/12 ,  C08L9/06 ,  C08L9/00 ,  C09J109/06 ,  B32B15/085 ,  C08L47/00 ,  C09D147/00 ,  C09J147/00 ,  C08J5/24 ,  H05K1/03 ,  B32B5/26

Abstract: The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

公开(公告)号：US11261305B2

公开(公告)日：2022-03-01

申请号：US16523753

申请日：2019-07-26

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbin Chen ,  Qianfa Liu ,  Shanyin Yan ,  Xianping Zeng ,  Cuiming Du

IPC: C08J5/24 ,  B32B15/14 ,  C08L25/10 ,  C08L47/00 ,  C08L71/12 ,  H05K1/03

Abstract: A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.

公开(公告)号：US11930595B2

公开(公告)日：2024-03-12

申请号：US17162122

申请日：2021-01-29

Applicant: Shengyi Technology Co., Ltd.

Inventor： Weifeng Yin ,  Cui Huo ,  Rui Liu ,  Yongjing Xu ,  Shanyin Yan

IPC: H05K1/03 ,  C09J11/06 ,  C09J153/02 ,  C09J171/12 ,  C09J179/08

CPC classification number: H05K1/0373 ,  C09J11/06 ,  C09J153/02 ,  C09J171/12 ,  C09J179/085 ,  C09J2203/326 ,  H05K2201/0158 ,  H05K2201/0195

Abstract: The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.

公开(公告)号：US11744013B2

公开(公告)日：2023-08-29

申请号：US15841439

申请日：2017-12-14

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Minshe Su ,  Duye Li ,  Shanyin Yan ,  Qianfa Liu ,  Zhongqiang Yang

IPC: H05K1/03 ,  B32B17/02 ,  B32B25/16 ,  B32B5/26 ,  C08J5/24 ,  H05K1/02

CPC classification number: H05K1/0373 ,  B32B5/26 ,  B32B17/02 ,  B32B25/16 ,  C08J5/244 ,  C08J5/249 ,  H05K1/0237 ,  H05K1/0366 ,  B32B2262/101 ,  B32B2307/204 ,  C08J2300/24 ,  C08J2325/10 ,  C08J2400/26 ,  C08J2423/16 ,  H05K2201/0154 ,  H05K2201/0278 ,  H05K2201/068

Abstract: The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite includes (1) from 20 to 70 parts by weight of a thermosetting mixture, including (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.

公开(公告)号：US11191158B2

公开(公告)日：2021-11-30

申请号：US15316380

申请日：2015-12-07

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Shanyin Yan ,  Yongjing Xu ,  Zhongqiang Yang ,  Yongming Zhu

IPC: H05K1/03 ,  C03C25/47 ,  C03C25/1095 ,  D06M15/53 ,  C09D109/00 ,  C09D171/12 ,  D06M11/44 ,  D06M11/45 ,  D06M11/46 ,  D06M15/233 ,  D06M23/10 ,  H05K3/38 ,  H05K1/02 ,  C08K3/22 ,  D06M101/00

Abstract: The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

公开(公告)号：US11053352B2

公开(公告)日：2021-07-06

申请号：US16523735

申请日：2019-07-26

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbin Chen ,  Qianfa Liu ,  Shanyin Yan ,  Xianping Zeng ,  Cuiming Du

IPC: C08K9/04 ,  C08G65/329 ,  C08F236/06 ,  C08J5/24 ,  C08K3/38 ,  C08K5/14 ,  C08K7/26 ,  C08L53/02 ,  C08F8/02 ,  C08F8/46

Abstract: A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.