公开(公告)号：US20090080168A1

公开(公告)日：2009-03-26

申请号：US12199489

申请日：2008-08-27

Applicant: Shigeru SUGINO

Inventor： Shigeru SUGINO

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/4046 ,  H01L2224/16227 ,  H05K1/023 ,  H05K1/113 ,  H05K1/184 ,  H05K1/186 ,  H05K3/0047 ,  H05K3/321 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10454 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/0242 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A printed circuit board includes a mounted a first electronic component. The printed circuit board includes a first through holes extending from a mounting surface on which the electronic component is mounted The printed circuit board includes a second through holes extending from a surface opposite the mounting surface and aligned with the first through holes. A second electronic component may be longitudinally between the first through holes and the second through holes. The first and second through holes may be electrically connected with the second electronic component.

Abstract translation: 印刷电路板包括安装的第一电子部件。 印刷电路板包括从其上安装电子部件的安装表面延伸的第一通孔。印刷电路板包括从与安装表面相对的表面延伸并与第一通孔对准的第二通孔。 第二电子部件可以在第一通孔和第二通孔之间纵向延伸。 第一和第二通孔可以与第二电子部件电连接。

公开(公告)号：US20110286188A1

公开(公告)日：2011-11-24

申请号：US13048056

申请日：2011-03-15

Applicant: Ryo KANAI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Shigeru SUGINO ,  Kiyoyuki HATANAKA ,  Nobuo TAKETOMI

Inventor： Ryo KANAI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Shigeru SUGINO ,  Kiyoyuki HATANAKA ,  Nobuo TAKETOMI

IPC: H05K5/00 ,  H01L21/50 ,  H05K1/18

CPC classification number: H05K1/185 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4691 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2924/00

Abstract: A multilayer printed circuit board includes an interior interconnect layer, and a semiconductor package including a flexible interconnect structure whose distal end is a free end, wherein the flexible interconnect structure and the interior interconnect layer are electrically connected to each other.

Abstract translation: 多层印刷电路板包括内部互连层和包括其前端是自由端的柔性互连结构的半导体封装，其中柔性互连结构和内部互连层彼此电连接。

公开(公告)号：US20110132654A1

公开(公告)日：2011-06-09

申请号：US12959698

申请日：2010-12-03

Applicant: Nobuo TAKETOMI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Kiyoyuki HATANAKA ,  Shigeru SUGINO ,  Ryo KANAI

Inventor： Nobuo TAKETOMI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Kiyoyuki HATANAKA ,  Shigeru SUGINO ,  Ryo KANAI

IPC: H05K5/00 ,  H05K1/00 ,  H05K1/11 ,  B29C65/02

CPC classification number: H05K3/4694 ,  H05K1/0269 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09918 ,  H05K2201/09972 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/167

Abstract: A method for manufacturing a multilayer printed circuit board, and a printed circuit board manufactured according to the method, includes laterally-aligning a first inner substrate in which first insulation layers and first conductor layers are alternately laminated and a second inner substrate in which second insulation layers and second conductor layers are alternately laminated. The second inner substrate has a lager number of layers than the first inner substrate. The laterally-aligned first inner substrate and second inner substrate are placed between a pair of third insulation layers in a thickness direction. The pair of the third insulation layer are heated under pressure in the thickness direction. A conductor pattern is formed on surfaces of the pair of the third insulation layers.

Abstract translation: 一种制造多层印刷电路板的方法和根据该方法制造的印刷电路板，包括横向对准第一绝缘层和第一导体层交替层叠的第一内部基板和第二内部基板，其中第二绝缘层 层和第二导体层交替层叠。 第二内部衬底具有比第一内部衬底更多的层数。 横向排列的第一内部基板和第二内部基板在厚度方向上放置在一对第三绝缘层之间。 一对第三绝缘层在厚度方向上被加压。 在一对第三绝缘层的表面上形成导体图案。