公开(公告)号：US4991284A

公开(公告)日：1991-02-12

申请号：US319903

申请日：1989-03-06

Applicant: Shiro Ezaki

Inventor： Shiro Ezaki

IPC: H01C17/06 ,  H01C17/28 ,  H01L21/70 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/46

CPC classification number: H05K1/167 ,  H01C17/281 ,  H01L21/705 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K3/4685 ,  Y10T29/49099 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of manufacturing and monitoring the manufacture of a thick film circuit board device. The method includes the steps of forming a resistive layer in a prescribed pattern on an insulative base board, forming a first conductive layer on the insulative base board adjacent to the resistive layer with a gap of predetermined width therebetween and forming a second conductive layer in the gap and overlapping a portion of the resistive layer and the first conductive layer for establishing electrical contact between the resistive layer and the first conductive layer.

Abstract translation: 一种制造和监测厚膜电路板装置的制造方法。 该方法包括以下步骤：在绝缘基板上形成规定图案的电阻层，在与绝缘基板相邻的绝缘基板上形成第一导电层，其间具有预定宽度的间隙，并在其中形成第二导电层 间隙并且与电阻层和第一导电层的一部分重叠，以在电阻层和第一导电层之间建立电接触。

公开(公告)号：US5256836A

公开(公告)日：1993-10-26

申请号：US764062

申请日：1991-09-24

Applicant: Shiro Ezaki

Inventor： Shiro Ezaki

IPC: H01L27/01 ,  H05K1/00

CPC classification number: H01L27/013 ,  Y10S428/901 ,  Y10T29/49151 ,  Y10T29/49156

Abstract: A thick film hybrid circuit board device is formed by laminating a first layer and a second layer on an insulative base board. The second layer being overlapped between over the insulative base board and the first layer has a recessed portion located at cross portion where peripheral edge portion of the first layer and a peripheral edge portion of the second layer are crossed. The recessed portion is formed in the shape of being recessed inwardly of the second layer. Bleedings generated from the second layer consisting of paste are held in the recessed portion, so that short circuit accidents caused by the bleedings mutually combined are effectively prevented.

Abstract translation: 通过在绝缘基板上层叠第一层和第二层来形成厚膜混合电路板装置。 绝缘基板与第一层之间重叠的第二层具有位于第一层的周缘部和第二层的周缘部交叉的交叉部的凹部。 凹部形成为向第二层向内凹陷的形状。 从由糊料构成的第二层产生的渗漏保持在凹部中，从而有效地防止了由相互组合的渗色引起的短路事故。

公开(公告)号：US4835038A

公开(公告)日：1989-05-30

申请号：US153432

申请日：1988-02-08

Applicant: Tsuneo Kaneko ,  Shiro Ezaki

Inventor： Tsuneo Kaneko ,  Shiro Ezaki

IPC: H01L27/01 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/46

CPC classification number: H05K3/4667 ,  H01L27/013 ,  H05K1/167 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K2203/086 ,  H05K2203/1126 ,  H05K2203/1461 ,  H05K3/1291 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A substrate coated with a plurality of thick films wherein conductive layers are wholly prepared from conductive paste. The present invention offers the advantages that the drawbacks accompanying the conventional conductor of silver-palladium base are overcome by forming a resistor having a required resistivity and a high reproducibility. A conductive paste and insulative paste are fired at a lower temperature than that at which the resistor paste is fired, without reducing the adhesion strength of the conductive layer to the substrates. A low temperature melting point crystalline composition is used as an insulative layer to ensure that the resistance of the resistor is not adversely affected by repeated firings.

Abstract translation: 涂覆有多个厚膜的基材，其中导电层由导电浆料完全制备。 本发明提供了通过形成具有所需电阻率和高再现性的电阻器来克服伴随常规的银 - 钯基体导体的缺点的优点。 导电糊和绝缘膏的烧制温度比电阻膏煅烧的温度低，而不会降低导电层对基片的粘附强度。 使用低温熔点结晶组合物作为绝缘层，以确保电阻器的电阻不受反复点火的不利影响。

公开(公告)号：US06617551B2

公开(公告)日：2003-09-09

申请号：US10132729

申请日：2002-04-26

Applicant: Ikue Karube ,  Shiro Ezaki ,  Takaaki Karube

Inventor： Ikue Karube ,  Shiro Ezaki ,  Takaaki Karube

IPC: G03G1520

CPC classification number: H05B3/0095 ,  G03G15/2057 ,  G03G15/2064 ,  G03G2215/2016 ,  G03G2215/2038 ,  H05B3/12

Abstract: A heater having a substrate composed of a heat-resistant and electrically insulating material, a heater element formed on the surface of the substrate in a belt-shape in the longitudinal direction containing an alloy of Ag and Pd having a weight ratio Ag/Pd of 90/10 to 70/30, glass, and an inorganic oxide and/or an inorganic nitride of 0.1 to 20 wt % to the weight of the alloy of Ag and Pd, and a power supply terminal part formed in connection with the heater element. The heater is suited to use for a fixing device of an image forming apparatus.

公开(公告)号：US6084350A

公开(公告)日：2000-07-04

申请号：US31724

申请日：1998-02-27

Applicant: Shiro Ezaki ,  Tsukasa Sugano

Inventor： Shiro Ezaki ,  Tsukasa Sugano

IPC: G03G15/02 ,  B41J2/395 ,  G03G15/00 ,  H01T19/00 ,  H01T23/00 ,  H01J17/49

CPC classification number: B41J2/395 ,  H01T19/00 ,  H01T23/00

Abstract: An ion generating device according to the present invention has a substrate having at least one insulating surface. A pair of electrodes is separately formed on the substrate to generate a corona discharge therebetween for ionizing gas floating in the atmosphere around the device. A protective layer having a thickness between 0.5 .mu.m and 10 .mu.m is limitedly coated on an exposed surface of the electrode.

Abstract translation: 根据本发明的离子产生装置具有至少一个绝缘表面的基底。 在基板上分别形成一对电极，以在其间产生电晕放电，用于电离浮在装置周围的大气中的气体。 厚度在0.5μm至10μm之间的保护层被有限地涂覆在电极的暴露表面上。

公开(公告)号：US5362927A

公开(公告)日：1994-11-08

申请号：US92800

申请日：1993-07-19

Applicant: Shiro Ezaki

Inventor： Shiro Ezaki

IPC: H01L27/01 ,  H05K1/00

CPC classification number: H01L27/013 ,  Y10S428/901 ,  Y10T29/49151 ,  Y10T29/49156

Abstract: A thick film hybrid circuit board device is formed by laminating a first layer and a second layer on an insulative base board. The second layer being overlapped between over the insulative base board and the first layer has a recessed portion located at cross portion where peripheral edge portion of the first layer and a peripheral edge portion of the second layer are crossed. The recessed portion is formed in the shape of being recessed inwardly of the second layer. Bleedings generated from the second layer consisting of paste are held in the recessed portion, so that short circuit accidents caused by the bleedings mutually combined are effectively prevented.

Abstract translation: 通过在绝缘基板上层叠第一层和第二层来形成厚膜混合电路板装置。 绝缘基板与第一层之间重叠的第二层具有位于第一层的周缘部和第二层的周缘部交叉的交叉部的凹部。 凹部形成为向第二层向内凹陷的形状。 从由糊料构成的第二层产生的渗漏保持在凹部中，从而有效地防止了由相互组合的渗色引起的短路事故。

公开(公告)号：US4830878A

公开(公告)日：1989-05-16

申请号：US71669

申请日：1987-07-09

Applicant: Tsuneo Kaneko ,  Shiro Ezaki

Inventor： Tsuneo Kaneko ,  Shiro Ezaki

IPC: H01L27/01 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/46

CPC classification number: H05K3/4667 ,  H01L27/013 ,  H05K1/167 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K2203/086 ,  H05K2203/1126 ,  H05K2203/1461 ,  H05K3/1291 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A method of manufacturing a substrate coated with a plurality of thick films wherein conductive layers are wholly prepared from conductive paste, and also a device comprising the substrate. The present invention offers the advantages that the drawbacks accompanying the conventional conductor of silver-palladium base are overcome by forming a resistor having a required resistivity and a high reproducibility. A conductive paste and insulative paste are fired at a lower temperature than that at which the resistor paste is fired, without reducing the adhesion strength of the conductive layer to the substrate. A low temperature melting point crystalline composition is used as an insulative layer to ensure that the resistance of the resistor is not adversely affected by repeated firings.

Abstract translation: 制造涂覆有多个厚膜的基材的方法，其中导电层由导电浆料完全制备，以及包含该基材的装置。 本发明提供了通过形成具有所需电阻率和高再现性的电阻器来克服伴随常规的银 - 钯基体导体的缺点的优点。 导电糊和绝缘膏在比电阻膏煅烧的温度低的温度下烧制，而不会降低导电层对基片的粘附强度。 使用低温熔点结晶组合物作为绝缘层，以确保电阻器的电阻不受反复点火的不利影响。