公开(公告)号：US20180213633A1

公开(公告)日：2018-07-26

申请号：US15499586

申请日：2017-04-27

Applicant: Shiu Li Technology Co., Ltd.

Inventor： Chung-Cheng Chien

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/12

CPC classification number: H05K1/0209 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/14 ,  H05K3/44 ,  H05K2201/0266 ,  H05K2201/10106 ,  H05K2203/0736 ,  H05K2203/1366

Abstract: A heat dissipator having a circuit formed by screen printing or spraying includes a circuit layer and an isolation layer. The circuit layer, which is on a surface of a heat dissipation part of the heat dissipator having the circuit formed by screen printing or spraying, is formed by screen printing or spraying a uniformly distributed plastic material and low electrical resistance conductive powder. The isolation layer is disposed on the circuit layer and the heat dissipation part.