公开(公告)号：US08077472B2

公开(公告)日：2011-12-13

申请号：US12211035

申请日：2008-09-15

Applicant: Shu-Tzu Liu

Inventor： Shu-Tzu Liu

IPC: H05K5/00 ,  H05K1/09

CPC classification number: H05K3/0094 ,  H05K1/0215 ,  H05K1/05 ,  H05K1/116 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10409 ,  H05K2203/043

Abstract: A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component. The tin layer is formed on a surface of the main body around the through hole. The tin layer contacts the grounding component. The solder mask is formed between a periphery of the through hole and the tin layer. The solder mask is configured to prevent tin cream of the tin layer from flowing into the through hole.

Abstract translation: 本公开的印刷电路板包括主体，锡层和焊料掩模。 主体限定了连接到接地部件的通孔。 锡层围绕通孔形成在主体的表面上。 锡层接触接地部件。 在通孔的周边和锡层之间形成焊料掩模。 焊锡掩模被配置为防止锡层的锡膏流入通孔。