公开(公告)号：US20030203101A1

公开(公告)日：2003-10-30

申请号：US10422557

申请日：2003-04-23

Applicant: SiPix Imaging, Inc.

Inventor： Jeanne E. Haubrich ,  Y. S. Chaug ,  Zarng-Arh George Wu ,  Abbas Hosseini ,  Paul Gendler ,  Rong-Chang Liang

IPC: B05D005/12 ,  C25D005/02

CPC classification number: G02F1/13439 ,  H05K3/04 ,  H05K3/048 ,  H05K3/146 ,  H05K3/16 ,  H05K3/184 ,  H05K3/386 ,  H05K2201/0317 ,  H05K2203/0257 ,  H05K2203/0264 ,  H05K2203/0522 ,  H05K2203/0746

Abstract: A process for forming a patterned conductive structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired conductive structures will be formed in the areas where the printed material is not present, i.e., a negative image of conductive structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired conductive structures will be formed in the areas where the printed material is present, i.e., a positive image of the conductive structure is printed. The conductive material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned electrode structures.

Abstract translation: 公开了一种在衬底上形成图案化导电结构的工艺。 在衬底上印有诸如掩模涂层或墨水的材料的图案，该图案使得在一个实施例中，将在不存在印刷材料的区域中形成所需的导电结构，即 印刷要形成的导电结构的负像。 在另一个实施例中，图案用难以从衬底剥离的材料印刷，并且所需的导电结构将形成在印刷材料存在的区域中，即印刷导电结构的正像。 导电材料沉积在图案化的衬底上，并且不期望的区域被剥离，留下图案化的电极结构。