公开(公告)号：US12094727B2

公开(公告)日：2024-09-17

申请号：US17568167

申请日：2022-01-04

Applicant: Silicon Motion, Inc.

Inventor： Yi-Hung Chien ,  Chun-Ying Wang ,  Te-Wei Chen ,  Hsiu-Yuan Chen ,  Bing-Ling Wu

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L21/4878 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/565 ,  H01L21/561 ,  H01L24/95

Abstract: A method forming a semiconductor package device includes: providing a substrate; forming a flip chip die on a first side on the substrate; and forming a molding compound on the first side of the substrate. The molding compound covers the flip chip die. The method further includes forming a heat sink on the molding compound; and forming a taping layer on a second side of the substrate, wherein the second side is opposite from the first side in a vertical direction. After forming the taping layer, the method further includes performing a pre-cut process and an etching process on the heat sink; and removing the taping layer.