公开(公告)号：US20150004752A1

公开(公告)日：2015-01-01

申请号：US14085959

申请日：2013-11-21

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chang-Fu Lin ,  Chin-Tsai Yao ,  Ming-Chin Chuang ,  Keng-Hung Liu ,  Fu-Tang Huang

IPC: H01L21/78 ,  H01L23/544

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/06 ,  H01L24/17 ,  H01L2223/54453 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2924/15311 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00

Abstract: A semiconductor package is disclosed, which includes: a packaging substrate; a semiconductor element disposed on the packaging substrate in a flip-chip manner; a stopping portion formed at edges of the semiconductor element; an insulating layer formed on an active surface of the semiconductor element and the stopping portion; and an encapsulant formed between the packaging substrate and the insulating layer. The insulating layer has a recessed portion formed on the stopping portion and facing the packaging substrate such that during a reliability test, the recessed portion can prevent delamination occurring between the insulating layer and the stopping portion from extending to the active surface of the semiconductor element.

Abstract translation: 公开了一种半导体封装，其包括：封装基板; 以倒装芯片的方式设置在封装衬底上的半导体元件; 形成在所述半导体元件的边缘处的止动部; 绝缘层，形成在所述半导体元件的有源表面和所述止动部分上; 以及形成在包装基板和绝缘层之间的密封剂。 绝缘层具有形成在止动部分上并面向封装基板的凹陷部分，使得在可靠性测试期间，凹陷部分可以防止绝缘层和止动部分之间的分层延伸到半导体元件的有源表面。

公开(公告)号：US20170148679A1

公开(公告)日：2017-05-25

申请号：US15424116

申请日：2017-02-03

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chang-Fu Lin ,  Chin-Tsai Yao ,  Ming-Chin Chuang ,  Keng-Hung Liu ,  Fu-Tang Huang

IPC: H01L21/78 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/544

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/06 ,  H01L24/17 ,  H01L2223/54453 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2924/15311 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00

Abstract: A semiconductor package is disclosed, which includes: a packaging substrate; a semiconductor element disposed on the packaging substrate in a flip-chip manner; a stopping portion formed at edges of the semiconductor element; an insulating layer formed on an active surface of the semiconductor element and the stopping portion; and an encapsulant formed between the packaging substrate and the insulating layer. The insulating layer has a recessed portion formed on the stopping portion and facing the packaging substrate such that during a reliability test, the recessed portion can prevent delamination occurring between the insulating layer and the stopping portion from extending to the active surface of the semiconductor element.