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公开(公告)号：US20220225493A1
公开(公告)日：2022-07-14
申请号：US17465335
申请日：2021-09-02
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Ming-Fan Tsai , Chih-Wei Chen , Chien-Cheng Lin , Chao-Ya Yang , Chia-Yang Chen
IPC: H05K1/02
Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.
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公开(公告)号：US10587041B2
公开(公告)日：2020-03-10
申请号：US15596113
申请日：2017-05-16
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC: H01L23/552 , H01Q1/52 , H01Q9/42 , H01Q1/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/66 , H01Q1/22 , H01Q1/48
Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US11723144B2
公开(公告)日：2023-08-08
申请号：US17465335
申请日：2021-09-02
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Ming-Fan Tsai , Chih-Wei Chen , Chien-Cheng Lin , Chao-Ya Yang , Chia-Yang Chen
IPC: H05K1/02
CPC classification number: H05K1/0225 , H05K2201/10098
Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.
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公开(公告)号：US11476572B2
公开(公告)日：2022-10-18
申请号：US16750459
申请日：2020-01-23
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC: H01Q1/52 , H01Q9/42 , H01Q1/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/552 , H01L23/66 , H01Q1/22 , H01Q1/48
Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US11069633B2
公开(公告)日：2021-07-20
申请号：US16028798
申请日：2018-07-06
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Ming-Fan Tsai , Chih-Hsien Chiu , Tsung-Hsien Tsai , Chao-Ya Yang , Chia-Yang Chen
IPC: H01L23/66 , H01L23/498 , H01L23/552 , H01L23/04 , H01Q1/22 , H01Q1/52 , H01Q1/24 , H01Q9/42 , H01L23/31 , H01L23/00
Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.
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Patent Agency Ranking
公开(公告)号：US20170181287A1
公开(公告)日：2017-06-22
申请号：US15064016
申请日：2016-03-08
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Jyun-Yuan Jhang , Ming-Fan Tsai , Ho-Chuan Lin , Ying-Wei Lu , Guang-Hwa Ma
CPC classification number: H05K1/185 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/552 , H01L2224/04105 , H01L2224/12105 , H01Q1/2283 , H01Q1/24 , H01Q1/38 , H01Q9/0407 , H05K1/0216 , H05K1/115 , H05K2201/0723 , H05K2201/09209
Abstract: An electronic package is provided, which includes a substrate and an antenna board structure disposed on the substrate. The antenna board structure has a first portion, a second portion and a partition portion between the first portion and the second portion. As such, current can be split into two paths so as to spread electromagnetic radiation, and thus produce electromagnetic radiation with a high bandwidth.
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公开(公告)号：US20200161756A1
公开(公告)日：2020-05-21
申请号：US16750459
申请日：2020-01-23
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC: H01Q1/52 , H01Q1/48 , H01Q1/22 , H01L23/66 , H01L23/552 , H01L23/498 , H01L23/31 , H01L21/56 , H01Q1/24 , H01Q9/42
Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US20190214352A1
公开(公告)日：2019-07-11
申请号：US16028798
申请日：2018-07-06
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Ming-Fan Tsai , Chih-Hsien Chiu , Tsung-Hsien Tsai , Chao-Ya Yang , Chia-Yang Chen
IPC: H01L23/66 , H01L23/498 , H01L23/31 , H01L23/552 , H01L23/04 , H01Q1/22 , H01Q1/24 , H01Q1/52
Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.
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公开(公告)号：US09999132B2
公开(公告)日：2018-06-12
申请号：US15163045
申请日：2016-05-24
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chia-Yang Chen , Ying-Wei Lu , Jyun-Yuan Jhang , Ming-Fan Tsai
CPC classification number: H05K1/185 , G06K19/07777 , H01L25/00 , H01L2224/16225 , H01L2224/48091 , H01L2924/1815 , H05K1/165 , H05K1/186 , H05K3/0014 , H05K3/107 , H05K3/207 , H05K3/4602 , H05K3/465 , H05K2201/09118 , H05K2201/10098 , H05K2203/1327 , H01L2924/00014
Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.
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公开(公告)号：US20170201023A1
公开(公告)日：2017-07-13
申请号：US15083421
申请日：2016-03-29
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chia-Yang Chen , Ying-Wei Lu , Jyun-Yuan Jhang , Ming-Fan Tsai
IPC: H01Q9/04 , H01L23/498 , H01L23/66 , H01Q1/24 , H01Q1/48
CPC classification number: H01L23/49838 , H01L23/66 , H01L2223/6627 , H01L2223/6677 , H01Q1/243 , H01Q9/065 , H01Q19/104 , H01Q23/00
Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.
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