公开(公告)号：US20020093091A1

公开(公告)日：2002-07-18

申请号：US09838521

申请日：2001-04-19

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chien-Ping Huang ,  Zong-Da Ho ,  Che-Jung Chang

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/50 ,  H01L023/34 ,  H01L023/52

CPC classification number: H05K1/116 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/11 ,  H01L2924/14 ,  H05K1/112 ,  H05K3/3478 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09663 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/1178 ,  H01L2924/00

Abstract: A method for fabricating a ground-ball bonding structure on a TBGA package is proposed, which is characterized by the forming of a plurality of air vents around the ground-ball pad and cut all the way into the tape until reaching the bottommost surface of the tape. During solder-reflow process, this allows the trapped air in the via hole due to solder material being filled into the via hole to the outside atmosphere during solder-reflow process. Compared to the prior art, since the proposed method allows substantially no air-filled voids to be left in the via hole, the resulted ground ball would be fully collapsed against the heat sink and therefore coplanarized with respect to the signal ball. The coplanarity of the overall ball grid array would allow the TBGA package to be mounted properly onto a printed circuit board during SMT (Surface Mount Technology) process. In addition, the proposed method allows a reliable bonding between the ground ball and the heat sink thus assuring the grounding effect of the resulted TBGA package.

Abstract translation: 提出了一种在TBGA封装上制造地球接合结构的方法，其特征在于在地球垫周围形成多个通风孔，并将其全部切入带中，直至达到 胶带。 在焊锡回流工艺期间，由于在焊料回流过程中由于焊料材料被填充到通孔中而导致通孔中的被捕获的空气进入外部大气。 与现有技术相比，由于所提出的方法基本上没有空气填充的空隙留在通孔中，因此所产生的磨球将完全折叠在散热片上，因此相对于信号球共面。 整个球栅阵列的共面性将允许在SMT（表面贴装技术）工艺中将TBGA封装适当地安装到印刷电路板上。 此外，所提出的方法允许接地球和散热器之间的可靠接合，从而确保所得TBGA封装的接地效果。