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    COMMUNICATION SYSTEM, DISPLAY CONTROL DEVICE, COMMUNICATION TERMINAL, AND COMPUTER-READABLE STORAGE MEDIUM ALLOWING SUPPLEMENTAL DOWNLINK WITH A LARGE CAPACITY UTILIZING OPTICAL COMMUNICATION
    1.
    发明申请
    COMMUNICATION SYSTEM, DISPLAY CONTROL DEVICE, COMMUNICATION TERMINAL, AND COMPUTER-READABLE STORAGE MEDIUM ALLOWING SUPPLEMENTAL DOWNLINK WITH A LARGE CAPACITY UTILIZING OPTICAL COMMUNICATION 有权

    公开(公告)号：US20230071454A1

    公开(公告)日：2023-03-09

    申请号：US17985162

    申请日：2022-11-11

    Applicant: SoftBank Corp.

    Inventor： Takashi TSUTSUI ,  Ayumu YABUKI

    IPC: H04N21/4363 ,  H04B7/0456 ,  H04N21/431 ,  H04W72/04

    Abstract: In accordance with increasing communication demand, means for efficiently providing mass downstream communication at a low cost are desired. Accordingly, a communication system providing supplemental downlink as well as multicast communication comprising a display control device for causing a display unit to display a video, and a communication terminal having an image capturing unit for directly capturing the video displayed by the display unit or capturing a video projected or reflected on a wall surface or the like is provided, wherein the display control device includes a video acquiring unit, a region identification unit, a video generating unit, and a display control unit, and the communication terminal includes a region identification unit, a decoding unit, and a mechanism for communicating a control signal for supplemental downlink by the above-described optical communication using means other than optical communication (means such as WiFi, mobile data communication or the like).

    SEMICONDUCTOR PACKAGE AND THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT USING LIQUID IMMERSION COOLING SYSTEM BY PERFORATED INTERPOZER
    2.
    发明申请
    SEMICONDUCTOR PACKAGE AND THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT USING LIQUID IMMERSION COOLING SYSTEM BY PERFORATED INTERPOZER 有权

    公开(公告)号：US20220238498A1

    公开(公告)日：2022-07-28

    申请号：US17721379

    申请日：2022-04-15

    Applicant: SoftBank Corp.

    Inventor： Takashi TSUTSUI

    IPC: H01L25/10

    Abstract: A three-dimensional stacked integrated circuit is configured such that a package provided with a semiconductor chip and an interposer substrate provided with an opening are alternately stacked with respective electrode terminals and electrode pads, the package and the interposer substrate include electrode terminals having a shape in which a gap is generated between the electrode terminals in a stacking direction in a stacked state, an electrode pad for connecting the electrode terminals, and a guide hole for holding accurate positioning and connection at a time of stacking, an interlayer communication path is formed by connecting the package and the interposer substrate, and a cooling liquid flows through the gap to perform liquid immersion cooling.

    AREA CONSTRUCTION METHOD
    5.
    发明申请
    AREA CONSTRUCTION METHOD 有权

    公开(公告)号：US20210250778A1

    公开(公告)日：2021-08-12

    申请号：US17244967

    申请日：2021-04-30

    Applicant: SoftBank Corp.

    Inventor： Takashi TSUTSUI

    IPC: H04W16/18 ,  H04W16/28

    Abstract: There is provided an area construction method for providing a 5G mobile wireless communication network service (hereinafter, referred to as a 5G service) using a millimeter wave, in which a wireless communication area is constructed by using line-of-sight propagation of a radio wave which is emitted by using a beam-forming technology from a base station, and rough surface scattering of the radio wave by a road surface, rather than by using a diffraction phenomenon of the radio wave which causes a large loss, and by using a U-shaped UE relay or CPE.

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