公开(公告)号：US09883594B2

公开(公告)日：2018-01-30

申请号：US15648465

申请日：2017-07-13

Applicant: Subtron Technology Co., Ltd.

Inventor： Yu-Chi Huang ,  Kuo-Tung Lin

IPC: H05K3/00 ,  H05K3/34

CPC classification number: H05K3/007 ,  B32B2457/08 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85005 ,  H01L2924/15151 ,  H01L2924/15313 ,  H05K3/3421 ,  H05K2201/0154 ,  H05K2201/09072 ,  H05K2203/0156 ,  H01L2924/00014

Abstract: A substrate structure including a carrier and a substrate is provided. The carrier includes a release layer, a dielectric layer and a metal layer. The dielectric layer is disposed between the release layer and the metal layer. The substrate includes a packaging region and a peripheral region. The peripheral region is connected to the packaging region and surrounds the packaging region. The peripheral region or the packaging region has a plurality of through holes. The substrate is disposed on the carrier. The release layer is located between the substrate and the dielectric layer. The release layer and the dielectric layer are filled in the through hole such that the substrate is separably attached to the carrier.

公开(公告)号：US20170311450A1

公开(公告)日：2017-10-26

申请号：US15648465

申请日：2017-07-13

Applicant: Subtron Technology Co., Ltd.

Inventor： Yu-Chi Huang ,  Kuo-Tung Lin

IPC: H05K3/00 ,  H05K3/34

CPC classification number: H05K3/007 ,  B32B2457/08 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85005 ,  H01L2924/15151 ,  H01L2924/15313 ,  H05K3/3421 ,  H05K2201/0154 ,  H05K2201/09072 ,  H05K2203/0156 ,  H01L2924/00014

Abstract: A substrate structure including a carrier and a substrate is provided. The carrier includes a release layer, a dielectric layer and a metal layer. The dielectric layer is disposed between the release layer and the metal layer. The substrate includes a packaging region and a peripheral region. The peripheral region is connected to the packaging region and surrounds the packaging region. The peripheral region or the packaging region has a plurality of through holes. The substrate is disposed on the carrier. The release layer is located between the substrate and the dielectric layer. The release layer and the dielectric layer are filled in the through hole such that the substrate is separably attached to the carrier.