公开(公告)号：US09933149B2

公开(公告)日：2018-04-03

申请号：US14691594

申请日：2015-04-21

Applicant: Subtron Technology Co., Ltd.

Inventor： Tzyy-Jang Tseng ,  Tzu-Shih Shen

IPC: F21V31/00 ,  F21V29/85 ,  F21V27/02 ,  F21V19/00 ,  F21V29/70 ,  F21V29/76 ,  F21Y115/10

CPC classification number: F21V31/005 ,  F21V19/0035 ,  F21V27/02 ,  F21V29/70 ,  F21V29/763 ,  F21V29/85 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An illumination apparatus includes a thermal conductivity substrate, a package carrier, at least one light emitting element, at least one wire, a light transmission cap, a first sealing ring and a second sealing ring. The package carrier is disposed on an upper surface of the thermal conductivity substrate and has an opening exposing a portion of the upper surface. The light emitting element is disposed on the upper surface exposed by the opening and is electrically connected to the package carrier by wire. The light transmission cap is disposed above the thermal conductivity substrate. The first sealing ring is disposed between the light transmission cap and the package carrier. The second sealing ring is disposed between the package carrier and the thermal conductivity substrate. The thermal conductivity substrate, the light transmission cap, the first and the second sealing rings and the package carrier encapsulate the light emitting element.

公开(公告)号：US20160209023A1

公开(公告)日：2016-07-21

申请号：US14691594

申请日：2015-04-21

Applicant: Subtron Technology Co., Ltd.

Inventor： Tzyy-Jang Tseng ,  Tzu-Shih Shen

IPC: F21V31/00 ,  F21V29/85 ,  F21V29/76

CPC classification number: F21V31/005 ,  F21V19/0035 ,  F21V27/02 ,  F21V29/70 ,  F21V29/763 ,  F21V29/85 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An illumination apparatus includes a thermal conductivity substrate, a package carrier, at least one light emitting element, at least one wire, a light transmission cap, a first sealing ring and a second sealing ring. The package carrier is disposed on an upper surface of the thermal conductivity substrate and has an opening exposing a portion of the upper surface. The light emitting element is disposed on the upper surface exposed by the opening and is electrically connected to the package carrier by wire. The light transmission cap is disposed above the thermal conductivity substrate. The first sealing ring is disposed between the light transmission cap and the package carrier. The second sealing ring is disposed between the package carrier and the thermal conductivity substrate. The thermal conductivity substrate, the light transmission cap, the first and the second sealing rings and the package carrier encapsulate the light emitting element.

Abstract translation: 照明装置包括导热基板，封装载体，至少一个发光元件，至少一个导线，光传输盖，第一密封环和第二密封环。 封装载体设置在导热基板的上表面上，并且具有暴露上表面的一部分的开口。 发光元件设置在由开口露出的上表面上，并通过导线与封装载体电连接。 光传输帽设置在导热性基板的上方。 第一密封环设置在透光帽和包装托架之间。 第二密封环设置在封装载体和导热基板之间。 导热性衬底，透光帽，第一和第二密封环和封装载体封装发光元件。