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公开(公告)号：US20200303271A1
公开(公告)日：2020-09-24
申请号：US16586913
申请日：2019-09-28
Applicant: Subtron Technology Co., Ltd.
Inventor： Chien-Hung Wu , Tzu-Shih Shen
IPC: H01L23/14 , H01L23/373 , H01L21/48
Abstract: A heat dissipation substrate includes an insulating layer, a metal heat dissipation block, and a patterned structure layer. The insulating layer has a first surface, a second surface and at least one through hole. The metal heat dissipation block passes through the insulating layer from the second surface of the insulating layer and has an upper surface, a lower surface, and a contact surface. There is a first vertical height between the contact surface and the lower surface. The patterned structure layer includes a patterned circuit layer and at least one conductive structure layer. The patterned circuit layer is disposed on the first surface of the insulating layer, and the conductive structure layer is connected to the patterned circuit layer and extends to cover an inner wall of the through hole. The patterned circuit layer has a top surface, the conductive structure layer has a bottom surface. There is a second vertical height between the top surface and the first surface, and the first vertical height is 3 times to 300 times the second vertical height.
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公开(公告)号：US10957614B2
公开(公告)日：2021-03-23
申请号：US16586913
申请日：2019-09-28
Applicant: Subtron Technology Co., Ltd.
Inventor： Chien-Hung Wu , Tzu-Shih Shen
IPC: H01L23/14 , H01L23/373 , H01L21/48
Abstract: A heat dissipation substrate includes an insulating layer, a metal heat dissipation block, and a patterned structure layer. The insulating layer has a first surface, a second surface and at least one through hole. The metal heat dissipation block passes through the insulating layer from the second surface of the insulating layer and has an upper surface, a lower surface, and a contact surface. There is a first vertical height between the contact surface and the lower surface. The patterned structure layer includes a patterned circuit layer and at least one conductive structure layer. The patterned circuit layer is disposed on the first surface of the insulating layer, and the conductive structure layer is connected to the patterned circuit layer and extends to cover an inner wall of the through hole. The patterned circuit layer has a top surface, the conductive structure layer has a bottom surface. There is a second vertical height between the top surface and the first surface, and the first vertical height is 3 times to 300 times the second vertical height.
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Patent Agency Ranking
公开(公告)号：US20230403826A1
公开(公告)日：2023-12-14
申请号：US17860076
申请日：2022-07-07
Applicant: Subtron Technology Co., Ltd.
Inventor： Chung Ying Lu , Tzu-Shih Shen , Chien-Hung Wu
CPC classification number: H05K7/20409 , H05K1/0306 , H05K1/0212
Abstract: A heat dissipation substrate includes heat dissipation blocks, an insulation filling structure, a first insulating layer, and a first circuit layer. Each heat dissipation block includes a first surface and a second surface opposite to the first surface. The insulation filling structure is disposed between the heat dissipation blocks to laterally connect the heat dissipation blocks. A first insulating surface of the insulation filling structure is substantially coplanar with the first surface of the heat dissipation block. A second insulating surface of the insulation filling structure is substantially coplanar with the second surface of the heat dissipation block. The first insulating layer is disposed on the first surface. The first circuit layer is disposed on the first insulating layer and penetrates the first insulating layer to be connected with the heat dissipation blocks. A thickness of the heat dissipation blocks is greater than a thickness of the first circuit layer.
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公开(公告)号：US09933149B2
公开(公告)日：2018-04-03
申请号：US14691594
申请日：2015-04-21
Applicant: Subtron Technology Co., Ltd.
Inventor： Tzyy-Jang Tseng , Tzu-Shih Shen
CPC classification number: F21V31/005 , F21V19/0035 , F21V27/02 , F21V29/70 , F21V29/763 , F21V29/85 , F21Y2115/10 , H01L2224/48091 , H01L2924/00014
Abstract: An illumination apparatus includes a thermal conductivity substrate, a package carrier, at least one light emitting element, at least one wire, a light transmission cap, a first sealing ring and a second sealing ring. The package carrier is disposed on an upper surface of the thermal conductivity substrate and has an opening exposing a portion of the upper surface. The light emitting element is disposed on the upper surface exposed by the opening and is electrically connected to the package carrier by wire. The light transmission cap is disposed above the thermal conductivity substrate. The first sealing ring is disposed between the light transmission cap and the package carrier. The second sealing ring is disposed between the package carrier and the thermal conductivity substrate. The thermal conductivity substrate, the light transmission cap, the first and the second sealing rings and the package carrier encapsulate the light emitting element.
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公开(公告)号：US11171072B2
公开(公告)日：2021-11-09
申请号：US16898417
申请日：2020-06-10
Applicant: Subtron Technology Co., Ltd.
Inventor： Chien-Hung Wu , Bo-Yu Huang , Chia-Wei Chang , Tzu-Shih Shen
IPC: H01L23/367 , H05K1/02 , H01L33/64 , H01L21/48 , H01L23/498
Abstract: A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.
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公开(公告)号：US20210050276A1
公开(公告)日：2021-02-18
申请号：US16898417
申请日：2020-06-10
Applicant: Subtron Technology Co., Ltd.
Inventor： Chien-Hung Wu , Bo-Yu Huang , Chia-Wei Chang , Tzu-Shih Shen
IPC: H01L23/367 , H01L33/64 , H01L23/498 , H01L21/48
Abstract: A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.
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公开(公告)号：US20160209023A1
公开(公告)日：2016-07-21
申请号：US14691594
申请日：2015-04-21
Applicant: Subtron Technology Co., Ltd.
Inventor： Tzyy-Jang Tseng , Tzu-Shih Shen
CPC classification number: F21V31/005 , F21V19/0035 , F21V27/02 , F21V29/70 , F21V29/763 , F21V29/85 , F21Y2115/10 , H01L2224/48091 , H01L2924/00014
Abstract: An illumination apparatus includes a thermal conductivity substrate, a package carrier, at least one light emitting element, at least one wire, a light transmission cap, a first sealing ring and a second sealing ring. The package carrier is disposed on an upper surface of the thermal conductivity substrate and has an opening exposing a portion of the upper surface. The light emitting element is disposed on the upper surface exposed by the opening and is electrically connected to the package carrier by wire. The light transmission cap is disposed above the thermal conductivity substrate. The first sealing ring is disposed between the light transmission cap and the package carrier. The second sealing ring is disposed between the package carrier and the thermal conductivity substrate. The thermal conductivity substrate, the light transmission cap, the first and the second sealing rings and the package carrier encapsulate the light emitting element.
Abstract translation: 照明装置包括导热基板，封装载体，至少一个发光元件，至少一个导线，光传输盖，第一密封环和第二密封环。 封装载体设置在导热基板的上表面上，并且具有暴露上表面的一部分的开口。 发光元件设置在由开口露出的上表面上，并通过导线与封装载体电连接。 光传输帽设置在导热性基板的上方。 第一密封环设置在透光帽和包装托架之间。 第二密封环设置在封装载体和导热基板之间。 导热性衬底，透光帽，第一和第二密封环和封装载体封装发光元件。
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