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公开(公告)号：US20170221960A1
公开(公告)日：2017-08-03
申请号：US15415934
申请日：2017-01-26
Applicant: SunASIC Technologies, Inc.
Inventor： Chi Chou LIN , Zheng Ping HE
IPC: H01L27/146 , H01L27/32 , G06K9/00 , H01L27/148
CPC classification number: H01L27/14678 , G06K9/0004 , H01L27/14625 , H01L27/14629 , H01L27/14643 , H01L27/14806 , H01L27/3227 , H01L51/5012 , H01L51/5056 , H01L51/5072 , H01L51/5234
Abstract: A contact image sensor is disclosed in the present invention. The contact image sensor includes: a substrate; an array of sensing units, formed above the substrate; a first insulation structure, formed over the sensing units and the substrate; a number of focusing units, formed above the first insulation structure, each focusing unit is aligned above a corresponding sensing unit with the first insulation structure sandwiched therebetween; a conductive metal layer, linked to a control circuit; an array of Organic Light-Emitting Diode (OLED) units, formed above the conductive metal layer and connected thereto; a transparent conductive layer, formed above the array of OLED units, and connected to the control circuit to control the statuses of the OLED units; and a transparent insulation structure, formed above the transparent conductive layer.
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公开(公告)号：US20180300520A1
公开(公告)日：2018-10-18
申请号：US15488536
申请日：2017-04-17
Applicant: SunASIC Technologies, Inc.
Inventor： Chi Chou LIN , Zheng Ping HE
IPC: G06K9/00
CPC classification number: G06K9/0002
Abstract: A capacitive image sensor with noise reduction feature and a method operating the capacitive image sensor are provided. The capacitive image sensor includes: a number of capacitive sensing units forming an array, each capacitive sensing unit for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output electric potential, wherein a value of the output electric potential is changed by a driving signal coupled on the finger; at least one sample-and-hold circuit for capturing and retaining different output electric potentials; at least one signal conditioning circuit, each comprising: at least one differential amplifier for amplifying a difference between two electric potentials retained by the sample-and-hold circuit; and a driving source, for providing the driving signal to the finger.
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公开(公告)号：US20190311097A1
公开(公告)日：2019-10-10
申请号：US15947956
申请日：2018-04-09
Applicant: SunASIC Technologies, Inc.
Inventor： Chi Chou LIN , Zheng Ping HE
Abstract: A biometric security device for digital key storing is disclosed. The biometric security device includes a biometric information fetching module and a processing module. The processing module has a nonvolatile storage unit and a processing unit. The nonvolatile storage unit includes a secure storage unit and a general storage unit. The biometric security device with a secure electronic key designed for storing secret data utilizes both TrustZone™ technology (or similar technology) and biometric authentication. Thus, it can provide the flexibility for multiple users or applications to use the biometric security device or any equipment the biometric security device mounted in without compromising the safeguard of the data stored therein.
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4.发明申请公开(公告)号：US20170142834A1
公开(公告)日：2017-05-18
申请号：US14941747
申请日：2015-11-16
Applicant: SunASIC Technologies, Inc.
Inventor： Chung Hao HSIEH , Chi Chou LIN , Zheng Ping HE
CPC classification number: H01L27/14609 , G06K9/00006 , G06K9/0002 , G06K9/00053 , H01L23/13 , H01L23/142 , H01L31/0203 , H05K1/18 , H05K1/181 , H05K3/284 , H05K3/30 , H05K2201/10151 , H05K2203/1316
Abstract: A Printed Circuit Board Assembly (PCBA) for forming an enhanced biometric module and a method for manufacturing the PCBA are disclosed. The method includes the steps of providing a PCB, a biometric sensing chip and SMDs; mounting the biometric sensing chip on the PCB with each bonding pad being electrically linked to one corresponding first contact pad; mounting the SMDs on second contact pads which are electrically linked thereto, respectively; and forming a protection layer. The present invention takes advantages of compact size of small conductive elements to avoid cracks in the protection layer.
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Patent Agency Ranking
公开(公告)号：US20210104563A1
公开(公告)日：2021-04-08
申请号：US16590463
申请日：2019-10-02
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou LIN , Zheng Ping HE
Abstract: An ultra-thin package structure for an integrated circuit having sensing functions is disclosed. It includes: a first substrate layer, having a first top side and a first bottom side, wherein a plurality of conductive traces are formed on the first top side and the first bottom side; an integrated circuit, having at least one gold-plated die pad on the top side thereof, wherein the at least one gold-plated die pad is connected to the corresponding conductive trace on the first bottom side of the first substrate layer by SMT; a second substrate layer, having a second top side and a second bottom side, wherein a plurality of conductive traces are formed on the second bottom side, and some portions of the conductive traces are covered by solder mask while other portions are exposed externally; and a filling material layer, formed between the first and the second substrate layer with the integrated circuit therebetween.
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6.发明申请公开(公告)号：US20180173919A1
公开(公告)日：2018-06-21
申请号：US15381182
申请日：2016-12-16
Applicant: SunASIC Technologies, Inc.
Inventor： Chi Chou LIN , Zheng Ping HE
CPC classification number: G06K9/0002 , H01L27/0629 , H03K17/9622 , H04N5/365
Abstract: A capacitive fingerprint sensor which includes capacitive sensing units is disclosed. Each of the capacitive sensing unit includes a sensing electrode; a first switch; a voltage follower; and a reference capacitor. The voltage follower includes an adjustable current source, for providing at least two distinct current levels; and a MOS transistor. The MOS transistor includes a source node, connected to ground via the adjustable current source and serves as an output node of the voltage follower; a gate node, connected to the sensing electrode and serves as an input node of the voltage follower; a drain node, connected to a power source, for providing power to the voltage follower; and a bulk node, connected to the source node.
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公开(公告)号：US20190220419A1
公开(公告)日：2019-07-18
申请号：US15869394
申请日：2018-01-12
Applicant: SunASIC Technologies, Inc.
Inventor： Chi Chou LIN , Hao-Jyh LIU , Zheng Ping HE
CPC classification number: G06F12/1408 , G06F21/105 , G06F21/575 , G06F2212/1052 , G06F2221/034 , G06F2221/0768 , G06Q50/184
Abstract: A secure electronic device is disclosed. The secure electronic device includes a first core processing unit, a secure boot Read-Only Memory, a first non-volatile memory, a first volatile memory and a first communication interface. A new framework based on the secure electronic device with built-in security is able to safeguard intellectual property for the developers and further improves the security of the secure electronic device. Thus, more developers can launch their programs or services without being stolen or tampered by an unauthorized party.
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8.发明申请公开(公告)号：US20170344797A1
公开(公告)日：2017-11-30
申请号：US15599498
申请日：2017-05-19
Applicant: SunASIC Technologies, Inc.
Inventor： Chung Hao HSIEH , Zheng Ping HE , Chi Chou LIN
CPC classification number: G06K9/00087 , G06F21/32 , G06K9/00053 , H01L21/561 , H01L23/3121 , H01L24/08 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/02 , H01L2224/29339 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/83801 , H01L2224/92247 , H01L2924/00014 , H01L2924/181 , H01L2924/19105 , H04L9/3231 , H04M1/667 , H01L2924/00012 , H01L2224/45099 , H01L2924/00
Abstract: A method for packaging fingerprint sensing chips and a fingerprint sensing module using the method are disclosed. The method includes the steps of: A. providing a number of PCBs for packaging fingerprint sensing chips, wherein the PCBs are connected in a form of a panel before cutting; each PCB located in the periphery has a protruding structure on a top surface thereof; each protruding structure connects to adjacent protruding structures to form an cofferdam body; B. mounting a fingerprint sensing chip and other electronic components for each PCB to form a number of PCBAs; C. fixing the PCBAs so that the top surfaces of the fingerprint sensing chips are on the same level substantially; D. dispensing a liquid packaging material to a space enclosed by the cofferdam body; E. curing the liquid packaging material; and F. cutting the connected PCBAs and removing the protruding structure to form independent PCBAs.
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公开(公告)号：US20170186716A1
公开(公告)日：2017-06-29
申请号：US15460482
申请日：2017-03-16
Applicant: SunASIC Technologies, Inc.
Inventor： Chi Chou LIN , Zheng Ping HE
IPC: H01L23/00 , H01L23/544 , G06K9/00 , H01L21/78
CPC classification number: H01L24/06 , G06F3/044 , G06K9/00006 , G06K9/00013 , G06K9/0004 , H01L21/76802 , H01L21/7685 , H01L21/76885 , H01L21/78 , H01L23/3171 , H01L23/544 , H01L24/03 , H01L24/05 , H01L2223/5446 , H01L2224/03614 , H01L2224/05026 , H01L2224/06135 , H01L2224/0912
Abstract: A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; a first metal layer, formed above the substrate; an inter-metal dielectric layer, formed above the first metal layer, having concave portions formed along the peripheries of the chip so that a portion of the first metal layer is exposed to form an input-output (I/O) pad in each of the concave portions which are spaced apart from each other; and a passivation layer, formed above the second metal layer without covering the concave portions so that specific circuits are formed by the first metal layer and the second metal layer, respectively. By changing the I/O pad from the top of the chip to the peripheries, the extra thickness of the packaged chip caused by wire bonding in the prior arts can be reduced.
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