Abstract:
A noise-reduced capacitive sensing unit is disclosed. The noise-reduced capacitive sensing unit includes: a sensing plate; a first bias voltage source for providing a first bias voltage; a second bias voltage source for providing a second bias voltage; a switch unit, connected between two bias voltage sources and the sensing plate, for selectively providing one of the bias voltages to the sensing plate; an excitation signal source for providing a bi-level waveform; a reference capacitor, formed between the excitation signal source and the sensing plate, for injecting the excitation signal to the sensing plate; and a voltage follower for providing sensing results, wherein an input node of the voltage follower is connected to the sensing plate.
Abstract:
A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; at least two metal layers, formed above the substrate, each metal layer forming a specific circuit, wherein two adjacent metal layers are separated by an inter-metal dielectric layer; and a passivation layer, formed on a top side of the chip. By changing the I/O pad from the top of the chip to the peripheries, the extra thickness of the packaged chip caused by wire bonding in the prior arts can be reduced.
Abstract:
A remote control for a smart TV or a set-top box is disclosed. The remote control includes a capacitive fingerprint sensor, a processor and a wireless transmitter. The present invention takes advantages of the capacitive fingerprint sensor so that every user's personal data and corresponding setting for the smart TV or set-top box are available. Channel (or web-site) content rating can be achieved. Purchasing over TV can be safer than ever.
Abstract:
A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.
Abstract:
An ultra-thin package structure for an integrated circuit having sensing functions is disclosed. It includes: a first substrate layer, having a first top side and a first bottom side, wherein a plurality of conductive traces are formed on the first top side and the first bottom side; an integrated circuit, having at least one gold-plated die pad on the top side thereof, wherein the at least one gold-plated die pad is connected to the corresponding conductive trace on the first bottom side of the first substrate layer by SMT; a second substrate layer, having a second top side and a second bottom side, wherein a plurality of conductive traces are formed on the second bottom side, and some portions of the conductive traces are covered by solder mask while other portions are exposed externally; and a filling material layer, formed between the first and the second substrate layer with the integrated circuit therebetween.
Abstract:
A Printed Circuit Board Assembly (PCBA) forming an enhanced fingerprint module is disclosed. The PCBA includes a Printed Circuit Board (PCB), an image sensing chip, at least one electrode and a protection layer. An opening in a first insulation layer and a second insulation layer of the PCB together form a sensor portion so that the image sensing chip can be packaged in the opening. Thus, the thickness of the enhanced fingerprint module can be thinner than other fingerprint modules provided by the conventional package methods.
Abstract:
A method for mounting a chip on a printed circuit board (PCB) is disclosed. The method includes the steps of: providing a chip having a plurality of bonding pads and a PCB having a recess portion and a plurality of connectors; gluing the recess portion; placing the chip into the recess portion; and forming circuit patterns linking associated bonding pad and connector. A bottom of the recess portion is substantially flat and a shape of the recess portion is similar to that of the chip but large enough so that the chip can be fixed in the recess portion after being glued.
Abstract:
A multi-function identification system is described in the present invention. The system includes an appliance and a number of keys. Under a registration process, the system allows multiple appliances to be controlled by a single key or an appliance can be controlled by different keys. The system can also allow users to set specified actions to be conducted after identification processes are completed. That satisfies requirements of a multi-function identification. Meanwhile, the key is a plug-and play and on-the-go product. It is desired that the key is a host used for other purpose.
Abstract:
A compound and securable key is disclosed in the present invention. It includes a printed circuit board, a fingerprint sensor, a micro control unit, and a housing. The present invention provides a key structure with combination of a physical key patterns and biometrics for identification. The key is convenient to carry, difficult to duplicate. It is also has advantages such as low cost, easy use, and compact size of biometric module. The invention enhances security of keys.
Abstract:
An electronic device having a structure that electrically connects the contactor to an electronic device during a testing process is disclosed. The contactor includes a holder for accommodating the electronic device during the testing process; a flexible circuit, having a first set of contacts electrically connected to the corresponding electrode terminals of the electronic device, and a second set of contacts electrically connected to a control unit that sends test signals during the test process; an elastomer, for adjusting the pressure between the first set of contacts of the flexible circuit and the corresponding electrode terminals of the electronic device while being pressed together; and an alignment tool, for aligning the first set of contacts with the corresponding electrode terminals of the electronic device. The electrode terminals of the electronic device are located on the same surface of the electronic device and the flexible circuit is detachable from the contactor.