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公开(公告)号：US20220089871A1
公开(公告)日：2022-03-24
申请号：US17426091
申请日：2020-02-05
Applicant: Sunstar Engineering Inc.
Inventor： Takuro OMACHI , Tomohiro YAMAGUCHI
Abstract: Excellent adhesiveness to resin substrates is provided even with a reduced pretreatment, preferably without a pretreatment, by a curable composition comprising an urethane prepolymer (A) having a polyoxyalkylene backbone and an isocyanate group, and an urethane prepolymer (B) having a polycarbonate and/or polyester backbone and an isocyanate group.
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