公开(公告)号：US20240359162A9

公开(公告)日：2024-10-31

申请号：US18502262

申请日：2023-11-06

Applicant: Sustaera Inc.

Inventor： Tyson Lee LANIGAN-ATKINS ,  Jian-Peng SHEN ,  Cory Elliott SANDERSON ,  Raghubir Prasad GUPTA

IPC: B01J20/32 ,  B01D53/62 ,  B01D53/82 ,  B01D53/96 ,  B01J20/04 ,  B01J20/08 ,  B01J20/28 ,  B01J20/30 ,  B01J20/34 ,  B05D3/02

CPC classification number: B01J20/3204 ,  B01D53/62 ,  B01D53/82 ,  B01D53/96 ,  B01J20/043 ,  B01J20/08 ,  B01J20/28042 ,  B01J20/3078 ,  B01J20/3234 ,  B01J20/3291 ,  B01J20/3433 ,  B01J20/3458 ,  B01J20/3483 ,  B05D3/0254 ,  B01D2251/304 ,  B01D2251/606 ,  B01D2257/504 ,  B01D2258/06

Abstract: A method for forming an integrated composite comprises providing a three-dimensional substrate having at least one channel; coating the substrate with a phenolic resin, wherein coating comprises dispersing the phenolic resin on the substrate, impregnating the phenolic resin in the substrate or a combination of both; curing the substrate and the phenolic resin; heating the cured substrate and cured phenolic resin to a temperature in a range of about 600° C. to about 1100° C. in an inert environment thereby pyrolyzing the phenolic resin, forming a conductive carbon network on, in, or both on and in the substrate; and coating a support material on, in, or both on and in the substrate to form an integrated composite.

公开(公告)号：US20240075457A1

公开(公告)日：2024-03-07

申请号：US18502262

申请日：2023-11-06

Applicant: Sustaera Inc.

Inventor： Tyson Lee LANIGAN-ATKINS ,  Jian-Peng SHEN ,  Cory Elliott SANDERSON ,  Raghubir Prasad GUPTA

IPC: B01J20/32 ,  B01D53/62 ,  B01D53/82 ,  B01D53/96 ,  B01J20/04 ,  B01J20/08 ,  B01J20/28 ,  B01J20/30 ,  B01J20/34 ,  B05D3/02

CPC classification number: B01J20/3204 ,  B01D53/62 ,  B01D53/82 ,  B01D53/96 ,  B01J20/043 ,  B01J20/08 ,  B01J20/28042 ,  B01J20/3078 ,  B01J20/3234 ,  B01J20/3291 ,  B01J20/3433 ,  B01J20/3458 ,  B01J20/3483 ,  B05D3/0254 ,  B01D2251/304 ,  B01D2251/606 ,  B01D2257/504 ,  B01D2258/06

Abstract: A method for forming an integrated composite comprises providing a three-dimensional substrate having at least one channel; coating the substrate with a phenolic resin, wherein coating comprises dispersing the phenolic resin on the substrate, impregnating the phenolic resin in the substrate or a combination of both; curing the substrate and the phenolic resin; heating the cured substrate and cured phenolic resin to a temperature in a range of about 600° C. to about 1100° C. in an inert environment thereby pyrolyzing the phenolic resin, forming a conductive carbon network on, in, or both on and in the substrate; and coating a support material on, in, or both on and in the substrate to form an integrated composite.