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    MULTILAYER STRUCTURE FOR CAPACITIVE PRESSURE SENSING
    2.
    发明申请
    MULTILAYER STRUCTURE FOR CAPACITIVE PRESSURE SENSING 审中-公开
    用于电容式压力感测的多层结构

    公开(公告)号：US20160290878A1

    公开(公告)日：2016-10-06

    申请号：US14677075

    申请日：2015-04-02

    Applicant: Tacto Tek Oy

    Inventor： Kari SEVERINKANGAS ,  Mikko HEIKKINEN ,  Jarmo SAASKI

    IPC: G01L1/14 ,  H05K3/10

    CPC classification number: G01L1/146 ,  A61B5/1038 ,  A61B5/112 ,  A61B5/6807 ,  H05K1/189 ,  H05K3/10 ,  H05K3/284 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/1305

    Abstract: A multilayer structure for a garment, optionally footwear, includes a flexible substrate film for accommodating electronics, a number of flexible sensor pads provided on the film utilizing printed electronics technology, optionally screen printing or ink jetting, at least one electronic circuit, preferably integrated circuit, further provided on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure, a number of conductor traces further printed on the film for electrically connecting the at least one electronic circuit and the number of capacitive sensor pads, a power supply element for powering electricity-driven components including the at least one electronic circuit, and at least one plastic layer molded upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin. A related method of manufacture is presented.

    Abstract translation: 用于衣服（可选地，鞋类）的多层结构包括用于容纳电子装置的柔性基底膜，利用印刷电子技术，可选地丝网印刷或喷墨的薄膜上设置的多个柔性传感器垫，至少一个电子电路，优选集成电路 进一步设置在胶片上，用于经由多个传感器焊盘控制电容测量，以获得经受多层结构的压力的指示，多个导体迹线进一步印刷在膜上，用于电连接至少一个电子电路和数字 电容传感器焊盘，用于向包括所述至少一个电子电路的电力驱动部件供电的电源元件，以及模塑在所述膜上的至少一个塑料层，基本上嵌入所述多个传感器焊盘，导体迹线和所述至少一个电子电路 在其中。 提出了相关的制造方法。

    MULTI-MATERIAL STRUCTURE WITH EMBEDDED ELECTRONICS
    3.
    发明申请
    MULTI-MATERIAL STRUCTURE WITH EMBEDDED ELECTRONICS 审中-公开
    具有嵌入式电子学的多材料结构

    公开(公告)号：US20160295702A1

    公开(公告)日：2016-10-06

    申请号：US14677062

    申请日：2015-04-02

    Applicant: Tacto Tek Oy

    Inventor： Mikko HEIKKINEN ,  Jarmo SAASKI

    IPC: H05K1/18 ,  H05K1/02 ,  H05K3/28 ,  H05K3/12 ,  H05K3/32

    CPC classification number: H05K1/186 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/12 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/1316 ,  H05K2203/1327

    Abstract: A multilayer structure for an electronic device, includes a flexible substrate film (202, 502) for accommodating electronics, a number of electronic components (308, 508) provided on a first surface area (401A, 501A) of the film, the film also including a second surface area adjacent (401B, 501B) to the first surface area, and a number of conductive traces (412, 512) printed on the substrate film for electrically connecting electronic components together, wherein the number of electronic components and the related first surface area of the substrate accommodating the components have been overmolded with first thermoplastic material (306, 506), the adjacent second surface area and at least part of the first area being overmolded with second thermoplastic material so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the substrate film and second thermoplastic material. A corresponding method of manufacture is presented.

    Abstract translation: 一种用于电子设备的多层结构，包括用于容纳电子设备的柔性基底膜（202,502），设置在所述膜的第一表面区域（401A，501A）上的多个电子部件（308,508），所述膜还 包括与第一表面区域相邻（401B，501B）的第二表面区域和印刷在基板膜上的用于将电子元件电连接在一起的多个导电迹线（412,512），其中电子元件的数量和相关的第一 使用第一热塑性材料（306,506）将包含部件的基材的表面积包覆成型，相邻的第二表面区域和第一区域的至少一部分用第二热塑性材料包覆成型，使得至少部分电子部件和 其上的第一热塑性材料基本上嵌入在基底膜和第二热塑性材料之间。 提出了相应的制造方法。

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