公开(公告)号：US20170119946A1

公开(公告)日：2017-05-04

申请号：US15408136

申请日：2017-01-17

Applicant: TC1 LLC

Inventor： Mark McChrystal ,  Joseph C. Stark, III

IPC: A61M1/10 ,  G01D5/14 ,  H05K1/18 ,  H05K3/30 ,  A61M1/12 ,  H05K1/11

CPC classification number: A61M1/1086 ,  A61M1/101 ,  A61M1/1012 ,  A61M1/1015 ,  A61M1/1017 ,  A61M1/1031 ,  A61M1/1036 ,  A61M1/12 ,  A61M1/122 ,  A61M2205/3317 ,  A61M2205/3334 ,  A61M2205/3365 ,  A61M2207/00 ,  F04D13/064 ,  F04D15/0077 ,  G01B7/003 ,  G01B7/30 ,  G01D5/142 ,  G01R33/072 ,  H05K1/028 ,  H05K1/119 ,  H05K1/189 ,  H05K3/30 ,  H05K3/303 ,  H05K3/32 ,  H05K3/4691 ,  H05K2201/052 ,  H05K2201/10151 ,  Y10T29/49009 ,  Y10T29/49128

Abstract: Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.

公开(公告)号：US10413650B2

公开(公告)日：2019-09-17

申请号：US15286449

申请日：2016-10-05

Applicant: TC1 LLC

Inventor： Samuel Schimpf ,  Mark McChrystal ,  Joseph C. Stark, III ,  Andre Siebenhaar

IPC: A61M1/12 ,  H05K1/02 ,  G01B7/00 ,  A61M1/10 ,  H05K3/30 ,  F04D13/06 ,  G01B7/30 ,  H05K1/11 ,  H05K1/18 ,  F04D15/00 ,  G01R33/07 ,  H05K3/32 ,  G01D5/14 ,  H05K3/46

Abstract: A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.