公开(公告)号：US20250168986A1

公开(公告)日：2025-05-22

申请号：US18952034

申请日：2024-11-19

Applicant: TDK Corporation

Inventor： Akiko SEKI ,  Yukari WADA ,  Hiroyuki UEMATSU ,  Susumu TANIGUCHI

IPC: H05K1/18 ,  H05K3/34

Abstract: A circuit board includes: a substrate having a main surface; a first terminal and a second terminal provided on the main surface of the substrate; and a wall of an insulating material, the wall provided on the main surface of the substrate, in which the wall has at least one groove portion passing through an outer peripheral surface from an inner peripheral surface, the first and second terminals are disposed in a cavity surrounded by the wall, and when a rectangular reference shape having a minimum area circumscribing the inner peripheral surface of the wall is set as viewed from a first direction orthogonal to the main surface of the substrate, at least one terminal of the first and second terminals has a portion disposed on an outer peripheral side from the reference shape via the groove portion.

公开(公告)号：US20230163249A1

公开(公告)日：2023-05-25

申请号：US17991261

申请日：2022-11-21

Applicant: TDK CORPORATION

Inventor： Akiko SEKI ,  Takashi WATANABE ,  Yukari WADA ,  Susumu TANIGUCHI ,  Hiroyuki UEMATSU

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L33/60

Abstract: A circuit substrate is a circuit substrate having at least one pair of terminals, wherein a bonding material containing a metal element is disposed above the terminals, the pair of terminals and the bonding material are disposed inside a wall formed by an insulator, and the wall has an uneven portion on an inner side surface.

公开(公告)号：US20140293561A1

公开(公告)日：2014-10-02

申请号：US14302946

申请日：2014-06-12

Applicant: TDK CORPORATION

Inventor： Hiroyuki UEMATSU ,  Kenichi KAWABATA

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/115 ,  H01L2224/04105 ,  H05K1/185 ,  H05K1/188 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427 ,  H05K2201/0187 ,  H05K2201/09563 ,  H05K2203/095 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating on the inner wall of the via formation hole.

Abstract translation: 布线基板或电子部件嵌入基板包括：基板，其具有含有多个填料的树脂; 以及通孔，其电连接到提供给基板的至少一个互连件，其中所述通孔包括混合区域，在所述混合区域中，在相对于所述基板的内径向侧的所述填料之间设置有金属。 制造布线板或电子部件嵌入式基板的方法包括制备包括含有多种填料的树脂的基板; 在所述基板中形成通孔形成孔; 在通孔形成孔的至少内壁上进行灰化处理; 并且在通孔形成孔的内壁上进行无电镀。