公开(公告)号：US20200381266A1

公开(公告)日：2020-12-03

申请号：US16997092

申请日：2020-08-19

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L21/48 ,  C23C18/18 ,  C23C18/20 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  G03F7/00 ,  H01L33/62

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US20200211951A1

公开(公告)日：2020-07-02

申请号：US16811018

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US20190035719A1

公开(公告)日：2019-01-31

申请号：US16038491

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H05K3/40 ,  H01L21/48

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US20250168986A1

公开(公告)日：2025-05-22

申请号：US18952034

申请日：2024-11-19

Applicant: TDK Corporation

Inventor： Akiko SEKI ,  Yukari WADA ,  Hiroyuki UEMATSU ,  Susumu TANIGUCHI

IPC: H05K1/18 ,  H05K3/34

Abstract: A circuit board includes: a substrate having a main surface; a first terminal and a second terminal provided on the main surface of the substrate; and a wall of an insulating material, the wall provided on the main surface of the substrate, in which the wall has at least one groove portion passing through an outer peripheral surface from an inner peripheral surface, the first and second terminals are disposed in a cavity surrounded by the wall, and when a rectangular reference shape having a minimum area circumscribing the inner peripheral surface of the wall is set as viewed from a first direction orthogonal to the main surface of the substrate, at least one terminal of the first and second terminals has a portion disposed on an outer peripheral side from the reference shape via the groove portion.

公开(公告)号：US20240008183A1

公开(公告)日：2024-01-04

申请号：US18037130

申请日：2021-11-15

Applicant: TDK CORPORATION

Inventor： Kiryu IKEBE ,  Tomohisa MITOSE ,  Akiko SEKI ,  Susumu TANIGUCHI ,  Hisayuki ABE

IPC: H05K1/14 ,  H05K3/34

CPC classification number: H05K1/144 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/042

Abstract: A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d1 and long sides of the electronic component have a dimension d2, a value of (dimension d1−dimension d2) is 10 μm or less.

公开(公告)号：US20230163249A1

公开(公告)日：2023-05-25

申请号：US17991261

申请日：2022-11-21

Applicant: TDK CORPORATION

Inventor： Akiko SEKI ,  Takashi WATANABE ,  Yukari WADA ,  Susumu TANIGUCHI ,  Hiroyuki UEMATSU

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L33/60

Abstract: A circuit substrate is a circuit substrate having at least one pair of terminals, wherein a bonding material containing a metal element is disposed above the terminals, the pair of terminals and the bonding material are disposed inside a wall formed by an insulator, and the wall has an uneven portion on an inner side surface.

公开(公告)号：US20210265256A1

公开(公告)日：2021-08-26

申请号：US17314187

申请日：2021-05-07

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US20190043736A1

公开(公告)日：2019-02-07

申请号：US16038711

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L21/48 ,  H01L33/62 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US20250063665A1

公开(公告)日：2025-02-20

申请号：US18937697

申请日：2024-11-05

Applicant: TDK Corporation

Inventor： Yukari WADA ,  Akiko SEKI ,  Yuhei HOTTA ,  Atsushi SATO

IPC: H05K1/18 ,  H05K3/34

Abstract: A circuit board includes: a substrate; at least a pair of terminals provided on the substrate; a bonding material disposed on the terminals and containing a metal element; and a wall of an insulating material disposed on the substrate, in which the pair of terminals and the bonding material are disposed inside the wall, and at least one wall-frame portion of the wall has at least one groove portion passing through an outer peripheral surface from an inner peripheral surface.

公开(公告)号：US20230395766A1

公开(公告)日：2023-12-07

申请号：US18032212

申请日：2021-10-14

Applicant: TDK CORPORATION

Inventor： Tomohisa MITOSE ,  Kenichi KAWABATA ,  Susumu TANIGUCHI ,  Akiko SEKI

IPC: H01L33/62 ,  H01L23/00 ,  H05K1/18

CPC classification number: H01L33/62 ,  H01L24/16 ,  H01L24/13 ,  H05K1/181 ,  H01L24/73 ,  H01L24/32 ,  H01L2933/0066 ,  H01L2224/73204 ,  H01L2224/32237 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/81815 ,  H01L2224/81192 ,  H05K2201/10106 ,  H05K2201/09472 ,  H01L2924/12041 ,  H05K2201/09827

Abstract: A mounting board includes an electronic component having at least a pair of first terminals, and a circuit board having at least a pair of second terminals. The first terminal and the second terminal are bonded to each other by a bonding material. The first terminal, the second terminal, and the bonding material are disposed inside a recessed portion formed in a resin layer such that the periphery thereof is surrounded by the resin layer. When a total thickness of the first terminal, the second terminal, and the bonding material is a dimension h1, the dimension h1 is 1 μm to 20 μm. When a width of the first terminal is a dimension d1 and a width of the recessed portion of the resin layer is a dimension d2, a value of (dimension d2—dimension d1) is 10 μm or smaller.