公开(公告)号：US20210014966A1

公开(公告)日：2021-01-14

申请号：US16916229

申请日：2020-06-30

Applicant: TDK CORPORATION

Inventor： Takaaki MORITA ,  Seiko KOMATSU ,  Seiichi TAJIMA ,  Wakiko SATO

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/02 ,  H05K3/00

Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

公开(公告)号：US20200315008A1

公开(公告)日：2020-10-01

申请号：US16813025

申请日：2020-03-09

Applicant: TDK CORPORATION

Inventor： Seiko KOMATSU ,  Takaaki MORITA ,  Seiichi TAJIMA

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46

Abstract: A multilayer board insulating sheet contains a reducing agent.

公开(公告)号：US20200315034A1

公开(公告)日：2020-10-01

申请号：US16812671

申请日：2020-03-09

Applicant: TDK CORPORATION

Inventor： Takaaki MORITA ,  Seiichi TAJIMA ,  Takashi KARIYA

IPC: H05K3/46 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/10

Abstract: A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.