公开(公告)号：US20230246006A1

公开(公告)日：2023-08-03

申请号：US18162183

申请日：2023-01-31

Applicant: TDK CORPORATION

Inventor： Ryohei KASAI ,  Takashi WATANABE ,  Susumu TANIGUCHI ,  Tomohisa MITOSE ,  Yuhei HOTTA

IPC: H01L25/075 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/05073 ,  H01L2224/05144 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/16503 ,  H01L2924/01327 ,  H01L2924/12041

Abstract: A joint structure, in which an electronic component and a wiring substrate are joined to each other, includes: a first layer being provided on one side of the electronic component and the wiring substrate, and being composed of a first metal containing Sn; a second layer being provided on the other side of the electronic component and the wiring substrate, and being composed of a second metal that forms an intermetallic compound with Sn; and a third layer being provided at a joint interface between the first layer and the second layer, and being composed of an intermetallic compound of the first metal and the second metal. An average thickness of the third layer is 0.1 μm or more to 0.5 μm or less.

公开(公告)号：US20250063665A1

公开(公告)日：2025-02-20

申请号：US18937697

申请日：2024-11-05

Applicant: TDK Corporation

Inventor： Yukari WADA ,  Akiko SEKI ,  Yuhei HOTTA ,  Atsushi SATO

IPC: H05K1/18 ,  H05K3/34

Abstract: A circuit board includes: a substrate; at least a pair of terminals provided on the substrate; a bonding material disposed on the terminals and containing a metal element; and a wall of an insulating material disposed on the substrate, in which the pair of terminals and the bonding material are disposed inside the wall, and at least one wall-frame portion of the wall has at least one groove portion passing through an outer peripheral surface from an inner peripheral surface.