公开(公告)号：US20180019043A1

公开(公告)日：2018-01-18

申请号：US15643956

申请日：2017-07-07

Applicant: TDK CORPORATION

Inventor： Koji MIURA ,  Ryoma NAKAZAWA ,  Katsushi YASUHARA ,  Tomohisa MITOSE

IPC: H01F1/147 ,  C22C38/10 ,  B22F9/08 ,  H01F3/08 ,  C22C38/02

CPC classification number: H01F1/14766 ,  B22F9/082 ,  B22F2001/0066 ,  B22F2301/35 ,  B22F2304/10 ,  B22F2998/10 ,  C22C1/05 ,  C22C33/0264 ,  C22C33/0285 ,  C22C38/02 ,  C22C38/10 ,  C22C2202/02 ,  H01F3/08 ,  B22F2003/023

Abstract: A soft magnetic metal powder includes a plurality of soft magnetic metal particles composed of an Fe—Co based alloy. The Fe—Co based alloy includes 0.50 mass % or more and 8.00 mass % or less of Co and a remaining part composed of Fe and an inevitable impurity. A soft magnetic metal powder includes a plurality of soft magnetic metal particles composed of an Fe—Co based alloy. The Fe—Co based alloy includes 0.50 mass % or more and 8.00 mass % or less of Co, 0.01 mass % or more and 8.00 mass % or less of Si, and a remaining part composed of Fe and an inevitable impurity. The present invention can provide a soft magnetic metal powder or so having a favorable corrosion resistance.

公开(公告)号：US20230395766A1

公开(公告)日：2023-12-07

申请号：US18032212

申请日：2021-10-14

Applicant: TDK CORPORATION

Inventor： Tomohisa MITOSE ,  Kenichi KAWABATA ,  Susumu TANIGUCHI ,  Akiko SEKI

IPC: H01L33/62 ,  H01L23/00 ,  H05K1/18

CPC classification number: H01L33/62 ,  H01L24/16 ,  H01L24/13 ,  H05K1/181 ,  H01L24/73 ,  H01L24/32 ,  H01L2933/0066 ,  H01L2224/73204 ,  H01L2224/32237 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/81815 ,  H01L2224/81192 ,  H05K2201/10106 ,  H05K2201/09472 ,  H01L2924/12041 ,  H05K2201/09827

Abstract: A mounting board includes an electronic component having at least a pair of first terminals, and a circuit board having at least a pair of second terminals. The first terminal and the second terminal are bonded to each other by a bonding material. The first terminal, the second terminal, and the bonding material are disposed inside a recessed portion formed in a resin layer such that the periphery thereof is surrounded by the resin layer. When a total thickness of the first terminal, the second terminal, and the bonding material is a dimension h1, the dimension h1 is 1 μm to 20 μm. When a width of the first terminal is a dimension d1 and a width of the recessed portion of the resin layer is a dimension d2, a value of (dimension d2—dimension d1) is 10 μm or smaller.

公开(公告)号：US20190148044A1

公开(公告)日：2019-05-16

申请号：US16189725

申请日：2018-11-13

Applicant: TDK CORPORATION

Inventor： Tomofumi KURODA ,  Yu SAKURAI ,  Tomohisa MITOSE

IPC: H01F1/147 ,  H01F3/08 ,  H01F41/02 ,  C22C38/02

Abstract: A method for producing soft magnetic metal powder includes: a raw material powder preparing step of preparing metal raw material powder having metal raw material particles including iron, silicon, and boron; a mixture step of mixing the metal raw material powder and a carbon source substance and obtaining mixed powder; and a heat treatment step of performing heat treatment on the mixed powder in a non-oxidizing atmosphere containing nitrogen at a heat treatment temperature of 1,250° C. or higher and making the metal raw material particles spherical.

公开(公告)号：US20230246006A1

公开(公告)日：2023-08-03

申请号：US18162183

申请日：2023-01-31

Applicant: TDK CORPORATION

Inventor： Ryohei KASAI ,  Takashi WATANABE ,  Susumu TANIGUCHI ,  Tomohisa MITOSE ,  Yuhei HOTTA

IPC: H01L25/075 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/05073 ,  H01L2224/05144 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/16503 ,  H01L2924/01327 ,  H01L2924/12041

Abstract: A joint structure, in which an electronic component and a wiring substrate are joined to each other, includes: a first layer being provided on one side of the electronic component and the wiring substrate, and being composed of a first metal containing Sn; a second layer being provided on the other side of the electronic component and the wiring substrate, and being composed of a second metal that forms an intermetallic compound with Sn; and a third layer being provided at a joint interface between the first layer and the second layer, and being composed of an intermetallic compound of the first metal and the second metal. An average thickness of the third layer is 0.1 μm or more to 0.5 μm or less.

公开(公告)号：US20240008183A1

公开(公告)日：2024-01-04

申请号：US18037130

申请日：2021-11-15

Applicant: TDK CORPORATION

Inventor： Kiryu IKEBE ,  Tomohisa MITOSE ,  Akiko SEKI ,  Susumu TANIGUCHI ,  Hisayuki ABE

IPC: H05K1/14 ,  H05K3/34

CPC classification number: H05K1/144 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/042

Abstract: A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d1 and long sides of the electronic component have a dimension d2, a value of (dimension d1−dimension d2) is 10 μm or less.