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公开(公告)号：US20200081244A1
公开(公告)日：2020-03-12
申请号：US16125237
申请日：2018-09-07
Applicant: Texas Instruments Incorporated
Inventor： Stephen Howard Looney , Jose Antonio Martinez
Abstract: Described examples include a micromechanical device including a substrate and a base formed on a surface of the substrate; and a first layer extending from the base to a plane separated from the base by a via. The first layer forms an outer layer of the via and has a portion lying in the plane and surrounding the via. A first fill is formed in a first portion of the via. A strut is in the via and on the first fill. A second fill is in a second portion of the via on the strut and extends from the strut to the plane. A second layer is over the second fill and at least a portion of the second layer is over the portion of the first layer lying in the plane.
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公开(公告)号：US20170176740A1
公开(公告)日：2017-06-22
申请号：US15003082
申请日：2016-01-21
Applicant: Texas Instruments Incorporated
Inventor： Lance William Barron , Jose Antonio Martinez , Earl Vedere Atnip
CPC classification number: G02B26/0833 , C23C16/34 , C23C16/405 , C23C16/50 , C23C28/321 , C23C28/345 , G02B1/115
Abstract: A microelectromechanical system (MEMS) is comprised of a micromirror attached to a semiconductor device. A stack of inorganic high index materials comprised of titanium oxide, titanium nitride, and titanium is deposited above metal levels within the semiconductor device. Another stack of inorganic high index materials comprised of titanium oxide, titanium nitride, and titanium may be deposited in a continuous or dis-continuous layer within one or more of the dielectric layers. Each stack of high index material films is deposited at a depth and of thickness to achieve a minimum reflectance for the entire film system and to ensure maximum destructive interference at the targeted wavelength range. The high index material stack results in reduced light scattering during operation of the micromirror and improves contrast of the display system.
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Patent Agency Ranking
公开(公告)号：US09335540B2
公开(公告)日：2016-05-10
申请号：US14109529
申请日：2013-12-17
Applicant: Texas Instruments Incorporated
Inventor： Lucius Marshall Sherwin , Jose Antonio Martinez , Ronald Charles Roth , Sean Christopher O'Brien
CPC classification number: G02B26/0833 , G02B26/005 , G02F1/167 , G02F2001/1676 , G02F2001/1678
Abstract: A microelectromechanical (MEMS) device has a movable member supported above a substrate on a via support. The member and via support are fabricated integrally from first and second member forming layers. A first member forming layer forms a lower part of the member and supporting structure for the via support. First and second fill layers are deposited and patterned to form a plug that fills an inner cavity opening in the via structure. The plug is planarized to a planar part of the first member forming layer, and a second member forming layer is deposited over the first member forming layer and the planarized plug to form an upper part of the member. The via support may have a cavity filled by BARC layers.
Abstract translation: 微机电（MEMS）装置具有支撑在通孔支架上的基板上方的可动构件。 构件和通孔支撑件由第一和第二构件形成层整体制造。 第一构件形成层形成构件的下部和用于通孔支撑的支撑结构。 第一和第二填充层被沉积并图案化以形成填充通孔结构中的内腔开口的塞子。 将插塞平面化到第一构件形成层的平面部分，并且第二构件形成层沉积在第一构件形成层和平坦化插塞上以形成构件的上部。 通孔支撑件可以具有由BARC层填充的空腔。
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公开(公告)号：US11203524B2
公开(公告)日：2021-12-21
申请号：US16798775
申请日：2020-02-24
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Jose Antonio Martinez
IPC: B81C1/00 , B81B7/00 , H01L23/552 , H01L23/00
Abstract: In described examples, a cavity is formed between a substrate and a cap. One or more access holes are formed through the cap for removing portions of a sacrificial layer from within the cavity. A cover is supported by the cap, where the cover is for occulting the one or more access holes along a perspective. An encapsulant seals the cavity, where the encapsulant encapsulates the cover and the one or more access holes.
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公开(公告)号：US10775609B2
公开(公告)日：2020-09-15
申请号：US16125237
申请日：2018-09-07
Applicant: Texas Instruments Incorporated
Inventor： Stephen Howard Looney , Jose Antonio Martinez
IPC: G02B26/00 , G02B26/08 , G02F1/167 , B81C1/00 , B81B7/02 , G02F1/1675 , G02F1/1676
Abstract: Described examples include a micromechanical device including a substrate and a base formed on a surface of the substrate; and a first layer extending from the base to a plane separated from the base by a via. The first layer forms an outer layer of the via and has a portion lying in the plane and surrounding the via. A first fill is formed in a first portion of the via. A strut is in the via and on the first fill. A second fill is in a second portion of the via on the strut and extends from the strut to the plane. A second layer is over the second fill and at least a portion of the second layer is over the portion of the first layer lying in the plane.
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公开(公告)号：US20150103391A1
公开(公告)日：2015-04-16
申请号：US14109529
申请日：2013-12-17
Applicant: Texas Instruments Incorporated
Inventor： Lucius Marshall Sherwin , Jose Antonio Martinez , Ronald Charles Roth , Sean Christopher O'Brien
IPC: G02B26/08
CPC classification number: G02B26/0833 , G02B26/005 , G02F1/167 , G02F2001/1676 , G02F2001/1678
Abstract: A microelectromechanical (MEMS) device has a movable member supported above a substrate on a via support. The member and via support are fabricated integrally from first and second member forming layers. A first member forming layer forms a lower part of the member and supporting structure for the via support. First and second fill layers are deposited and patterned to form a plug that fills an inner cavity opening in the via structure. The plug is planarized to a planar part of the first member forming layer, and a second member forming layer is deposited over the first member forming layer and the planarized plug to form an upper part of the member. In an example micromirror device, metal layers define a movable mirror member supported on a via support which has a cavity filled by BARC layers. The BARC layers are planarized to a planar portion of a first metal layer and a second metal layer is formed over the first metal layer planar portion and planarized BARC layer plug.
Abstract translation: 微机电（MEMS）装置具有支撑在通孔支架上的基板上方的可动构件。 构件和通孔支撑件由第一和第二构件形成层整体制造。 第一构件形成层形成构件的下部和用于通孔支撑的支撑结构。 第一和第二填充层被沉积并图案化以形成填充通孔结构中的内腔开口的塞子。 插塞平面化到第一构件形成层的平面部分，并且第二构件形成层沉积在第一构件形成层和平坦化插塞上以形成构件的上部。 在示例性微镜装置中，金属层限定支撑在通孔支撑件上的可移动镜构件，其具有由BARC层填充的空腔。 BARC层平面化到第一金属层的平面部分，并且第二金属层形成在第一金属层平面部分和平坦化的BARC层插塞之上。
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公开(公告)号：US20190185320A1
公开(公告)日：2019-06-20
申请号：US15846190
申请日：2017-12-18
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Jose Antonio Martinez
CPC classification number: B81C1/00793 , B81B7/0041 , B81B2201/01 , B81B2201/0221 , B81B2201/042 , B81C1/00293 , B81C2201/053
Abstract: In described examples, a cavity is formed between a substrate and a cap. One or more access holes are formed through the cap for removing portions of a sacrificial layer from within the cavity. A cover is supported by the cap, where the cover is for occulting the one or more access holes along a perspective. An encapsulant seals the cavity, where the encapsulant encapsulates the cover and the one or more access holes.
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