公开(公告)号：US20170196090A1

公开(公告)日：2017-07-06

申请号：US14985760

申请日：2015-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steven KUMMERL

IPC: H05K1/18 ,  H01R43/20

CPC classification number: H05K1/181 ,  H01R43/205 ,  H05K2201/1031 ,  H05K2201/10515 ,  Y02P70/611

Abstract: An apparatus includes an electrical device having a surface. The electrical device includes a first surface conductor spaced apart from a second surface conductor on the surface to provide circuit contacts to the device. A first standoff connector is bonded to the first surface conductor. The first standoff connector includes a leg having a proximal end bonded to the first surface conductor. The leg of the first standoff connector extends outwardly from the first surface conductor to a bend that is spaced apart from the surface of the electrical device. A second standoff connector is bonded to the second surface conductor. The second standoff connector includes a leg having a proximal end bonded to the second surface conductor. The leg of the second standoff connector extends outwardly from the second surface conductor to a bend that is spaced apart from the surface of the electrical device.

公开(公告)号：US20250006870A1

公开(公告)日：2025-01-02

申请号：US18345477

申请日：2023-06-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steven KUMMERL ,  Sparsh BALABADRAPATRUNI ,  Daniel FLINT

IPC: H01L33/50 ,  H01L33/52

Abstract: An example electronic device including a semiconductor die and a mold compound overlying the die, and the mold compound is chemically altered to attenuate electromagnetic radiation within a range of wavelengths or frequencies.