SYSTEM FOR REGULATING THE TEMPERATURE OF AN ASSEMBLY OF ELECTRONIC COMPONENTS OR FOR RECOVERING THE THERMAL ENERGY DISSIPATED BY AN ASSEMBLY OF ELECTRONIC COMPONENTS
    1.
    发明申请
    SYSTEM FOR REGULATING THE TEMPERATURE OF AN ASSEMBLY OF ELECTRONIC COMPONENTS OR FOR RECOVERING THE THERMAL ENERGY DISSIPATED BY AN ASSEMBLY OF ELECTRONIC COMPONENTS 审中-公开
    用于调节电子元件组装件温度或恢复由电子元器件组装散热的热能的系统

    公开(公告)号:US20150003017A1

    公开(公告)日:2015-01-01

    申请号:US14365084

    申请日:2012-12-06

    Applicant: THALES

    Abstract: A system for regulating the temperature of printed circuit boards comprises a first assembly of at least one Peltier element, for regulating the temperature of a second assembly of at least one electronic component or for harvesting thermal energy dissipated by the second assembly. At least one Peltier element of the first assembly is coupled to first heat-exchanging means that are coupled to at least one electronic component of the second assembly, and to second heat-exchanging means allowing thermal energy given off from at least one Peltier element of the first assembly to be dissipated.

    Abstract translation: 用于调节印刷电路板的温度的系统包括至少一个珀耳帖元件的第一组件,用于调节至少一个电子部件的第二组件的温度或用于收集由第二组件耗散的热能。 第一组件的至少一个珀耳帖元件被耦合到耦合到第二组件的至少一个电子部件的第一热交换装置,以及允许从至少一个珀耳帖元件发出的热能的第二热交换装置 第一个要消散的组件。

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