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公开(公告)号：US09918387B2
公开(公告)日：2018-03-13
申请号：US15090195
申请日：2016-04-04
Applicant: DENSO CORPORATION
Inventor： Toshihisa Yamamoto
CPC classification number: H05K3/0061 , B62D5/0406 , B62D5/0496 , H02K11/25 , H02K11/33 , H05K1/0201 , H05K1/0204 , H05K1/0207 , H05K2201/062 , H05K2201/10151 , H05K2201/10166 , H05K2201/10409
Abstract: An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.
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公开(公告)号：US20170330818A1
公开(公告)日：2017-11-16
申请号：US15527740
申请日：2015-12-11
Applicant: DENSO CORPORATION
Inventor： Tetsuto YAMAGISHI , Toshihiro NAGAYA , Masayuki TAKENAKA , Shinji HIRAMITSU
IPC: H01L23/40 , H01L23/28 , H01L23/367 , H05K1/02
CPC classification number: H01L23/40 , H01L23/145 , H01L23/28 , H01L23/29 , H01L23/3121 , H01L23/367 , H01L23/3737 , H01L23/4006 , H01L23/42 , H01L2023/405 , H01L2924/0002 , H05K1/0209 , H05K3/284 , H05K2201/062 , H05K2201/068 , H05K2201/09136 , H05K2201/10166 , H05K2201/10409 , H01L2924/00
Abstract: An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.
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公开(公告)号：US20170250140A1
公开(公告)日：2017-08-31
申请号：US15592973
申请日：2017-05-11
Applicant: Invensas Corporation
Inventor： Cyprian Emeka Uzoh , Rajesh Katkar
IPC: H01L23/00 , H05K1/02 , H05K1/03 , H01L23/498 , H01L21/48
CPC classification number: H01L23/562 , H01L21/4846 , H01L21/4857 , H01L21/486 , H01L23/15 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/49866 , H01L23/49894 , H01L23/5384 , H01L23/5387 , H05K1/0203 , H05K1/0326 , H05K2201/062 , H05K2201/10378
Abstract: A substrate structure is presented that can include a porous polyimide material and electrodes formed in the porous polyimide material. In some examples, a method of forming a substrate can include depositing a barrier layer on a substrate; depositing a resist over the barrier layer; patterning and etching the resist; forming electrodes; removing the resist; depositing a porous polyimide aerogel; depositing a dielectric layer over the aerogel material; polishing a top side of the interposer to expose the electrodes; and removing the substrate from the bottom side of the interposer.
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公开(公告)号：US20170164460A1
公开(公告)日：2017-06-08
申请号：US15224903
申请日：2016-08-01
Applicant: Samsung Display Co., Ltd.
Inventor： Siyoung CHOI , Moonshik KANG , Jeonghun GO , Yongsoon LEE
CPC classification number: H05K1/0203 , H05K1/0201 , H05K1/0298 , H05K1/0306 , H05K1/0373 , H05K1/18 , H05K3/46 , H05K2201/0116 , H05K2201/0187 , H05K2201/062 , H05K2201/09036 , H05K2201/09063 , H05K2201/10128
Abstract: A circuit board includes a base layer, a circuit layer disposed on the base layer, where an air gap is defined in the circuit layer, a heat blocking part disposed in the air gap, and an electronic element disposed on the circuit layer. The heat blocking part has a thermal conductivity lower than a thermal conductivity of the circuit layer.
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公开(公告)号：US09666514B2
公开(公告)日：2017-05-30
申请号：US14686671
申请日：2015-04-14
Applicant: Invensas Corporation
Inventor： Cyprian Emeka Uzoh , Rajesh Katkar
IPC: H05K1/00 , H01L23/498 , H01L21/48 , H01L23/538 , H01L23/15
CPC classification number: H01L23/562 , H01L21/4846 , H01L21/4857 , H01L21/486 , H01L23/15 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/49866 , H01L23/49894 , H01L23/5384 , H01L23/5387 , H05K1/0203 , H05K1/0326 , H05K2201/062 , H05K2201/10378
Abstract: A substrate structure is presented that can include a porous polyimide material and electrodes formed in the porous polyimide material. In some examples, a method of forming a substrate can include depositing a barrier layer on a substrate; depositing a resist over the barrier layer; patterning and etching the resist; forming electrodes; removing the resist; depositing a porous polyimide aerogel; depositing a dielectric layer over the aerogel material; polishing a top side of the interposer to expose the electrodes; and removing the substrate from the bottom side of the interposer.
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Patent Agency Ranking
公开(公告)号：US09521738B1
公开(公告)日：2016-12-13
申请号：US14560898
申请日：2014-12-04
Applicant: Flextronics AP, LLC
Inventor： Dennis Willie , Richard Loi , David Geiger , Anwar Mohammed , Murad Kurwa , Hector Rene Marin Hernandez
IPC: H05K7/20 , H05K1/02 , H01L23/473
CPC classification number: H05K1/0201 , H01L23/373 , H05K1/0203 , H05K1/0204 , H05K1/115 , H05K1/181 , H05K3/3494 , H05K7/20209 , H05K7/2039 , H05K2201/0323 , H05K2201/06 , H05K2201/062 , H05K2201/10371 , H05K2203/304
Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology.
Abstract translation: 形成的石墨片的形状和尺寸被设计为位于耦合到PCB的电子部件上方的保护屏蔽。 形成的石墨片用于保护电子部件的主体免受在电子部件组装到PCB期间所施加的热，例如在SMT和通孔技术中使用的加热步骤。
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公开(公告)号：US20160329774A1
公开(公告)日：2016-11-10
申请号：US15109832
申请日：2014-05-22
Applicant: MITSUBISHI ELECTRIC CORPORATION
Inventor： Rei ARAKI , Yu KAWANO , Yoshihito ASAO
CPC classification number: H02K5/24 , H02K11/21 , H02K11/25 , H02K11/33 , H05K1/0201 , H05K1/0216 , H05K1/115 , H05K1/181 , H05K2201/062 , H05K2201/09063 , H05K2201/09972 , H05K2201/1009 , H05K2201/10507
Abstract: A board includes a separating zone in an area closer to the edge than to the center of the board, the separating zone including one elongated through hole. A first group of electronic components that is a source of heat or electric noise is placed in a first area on the center side with respect to the separating zone of the board. On the other hand, a second group of electronic components from which influence of heat or electric noise from other components needs to be eliminated to a maximum extent is placed in a second area on the edge side with respect to the separating zone of the board.
Abstract translation: 板包括在靠近边缘的区域比板的中心更远的区域，分离区包括一个细长的通孔。 作为热或电噪声源的第一组电子部件被放置在相对于电路板的分离区域的中心侧的第一区域中。 另一方面，从第二组电子部件放置到相对于电路板的分离区域的边缘侧的第二区域中，来自其他部件的热或电噪声的影响需要最大程度地消除。
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公开(公告)号：US09466891B2
公开(公告)日：2016-10-11
申请号：US14505621
申请日：2014-10-03
Applicant: TELLABS OY
Inventor： Antti Holma , Juha Sarapelto
CPC classification number: H01R4/021 , H05K1/0201 , H05K1/115 , H05K1/116 , H05K1/181 , H05K2201/062 , H05K2201/0969 , H05K2201/09718
Abstract: A circuit board comprises one or more first electrical conductors (102-107) in a first portion of the thickness of the circuit board, one or more second electrical conductors (108, 109) in a second portion of the circuit board, at least one via-conductor (112) providing a galvanic current path between the first and second electrical conductors, a hole extending through the first and second portions of the circuit board, and an electrically conductive sleeve (114) lining the hole and having galvanic contacts with the second electrical conductors. The thermal resistance from the electrically conductive sleeve to the first electrical conductors is greater than the thermal resistance from the electrically conductive sleeve to the second electrical conductors so as to obtain a reliable solder joint between a part of the electrically conductive sleeve belonging to the first portion of the circuit board and an electrical conductor pin (119) located in the hole.
Abstract translation: 电路板包括在电路板的厚度的第一部分中的一个或多个第一电导体（102-107），在电路板的第二部分中的一个或多个第二电导体（108,109），至少一个 通孔导体（112）在第一和第二电导体之间提供电流通路，延伸穿过电路板的第一和第二部分的孔以及衬套孔的导电套筒（114），并且具有与 第二电导体。 从导电套管到第一电导体的热阻大于从导电套筒到第二电导体的热阻，以便在属于第一部分的导电套筒的一部分之间获得可靠的焊接接头 和位于孔中的电导体销（119）。
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公开(公告)号：US09408295B2
公开(公告)日：2016-08-02
申请号：US14701792
申请日：2015-05-01
Applicant: NGK Insulators, Ltd.
Inventor： Shinsuke Yano , Makoto Tani , Hirokazu Nakanishi
CPC classification number: H05K1/0207 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/16245 , H01L2933/0066 , H05K1/0204 , H05K1/0209 , H05K1/053 , H05K2201/0137 , H05K2201/062 , H05K2201/068 , H05K2201/10106 , H05K2201/10416 , H05K2203/1126
Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.
Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基底和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种通过实现低热阻作为整个基板的总热阻而可以显示出高散热能力而不降低基板的绝缘可靠性和高湿度可靠性的发光二极管的基板。
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公开(公告)号：US09402300B2
公开(公告)日：2016-07-26
申请号：US14701730
申请日：2015-05-01
Applicant: NGK Insulators, Ltd.
Inventor： Shinsuke Yano , Makoto Tani , Hirokazu Nakanishi
CPC classification number: H05K1/0203 , H01L33/486 , H01L33/62 , H01L33/641 , H01L2924/0002 , H01L2933/0066 , H05K1/0204 , H05K1/0209 , H05K1/0298 , H05K1/053 , H05K2201/062 , H05K2201/068 , H05K2201/10106 , H05K2201/10416 , H05K2203/1126 , H01L2924/00
Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing an insulation reliability and high-humidity reliability of the substrate is provided.
Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基底和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种通过在不降低基板的绝缘可靠性和高湿度可靠性的情况下实现作为整个基板的总热阻的低热阻而能够显示高散热能力的发光二极管的基板。
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