公开(公告)号：US20160135280A1

公开(公告)日：2016-05-12

申请号：US14897615

申请日：2014-06-10

Applicant: THALES

Inventor： Sebastien BONNET ,  Serge VERDEYME ,  Michel CAMPOVECCHIO ,  Alain DRAVET ,  Marc-Yves LIENHART

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/40 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H05K1/0204 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/183 ,  H05K3/0011 ,  H05K3/40 ,  H05K3/4623 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09072 ,  H05K2201/09845 ,  H05K2201/10416 ,  H05K2201/1056

Abstract: The printed circuit with a multi-layer structure comprises: a first layer machined to form a spotface passing through the layer, a second layer comprising a first cavity passing through the layer, a third layer comprising, on one face, an electronic component that it is in the first cavity, a fourth layer comprising a second cavity, a heat-conducting element with two parts: one made of metal, called a thermal cover, inserted into the spotface of the first layer so as to close, mechanically and electrically, the first cavity, the other made of a dielectric material with heat conduction >30 W/(m·K), placed in the first cavity so as to be in contact with the electronic component.

Abstract translation: 具有多层结构的印刷电路包括：加工成形成通过该层的点表面的第一层，包含通过该层的第一腔的第二层，在一个面上包括电子部件的第三层， 在第一空腔中，包括第二空腔的第四层，具有两部分的导热元件：一个由金属制成的称为热盖的导热元件，其被插入到第一层的表面中以机械和电气闭合， 第一腔，另一个由导热> 30W /（m·K）的介电材料制成，放置在第一腔中以与电子部件接触。