公开(公告)号：US09560753B2

公开(公告)日：2017-01-31

申请号：US15016212

申请日：2016-02-04

Applicant: TM TECHNOLOGY, INC

Inventor： Ben Wu ,  Wen-Doe Su

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/09 ,  H05K3/46 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/0298 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2933/0075 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0017 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2203/0562

Abstract: A light emitting diode load board includes a substrate, a first dielectric layer, a second dielectric layer and a first conductive pad and a second conductive pad. The second dielectric layer includes a first structure part, a second structure part and a third structure part. The first dielectric layer is disposed on the substrate. The first structure part is disposed on the first dielectric layer and has a first sidewall. The second structure part is disposed on the first structure part and has a second sidewall. The third structure part is disposed on the second structure part and has N sidewalls. The second sidewall is more prominent than the first sidewall. The first sidewall, the second sidewall and the N sidewalls define the first etched part, and the part of the first dielectric layer is exposed from the first etched part. The first conductive pad is disposed in the first etched part. The second conductive is disposed on the second dielectric layer, covers part of the second dielectric and exposes the open of the first etched part.

Abstract translation: 发光二极管负载板包括衬底，第一电介质层，第二电介质层和第一导电焊盘和第二导电焊盘。 第二电介质层包括第一结构部分，第二结构部分和第三结构部分。 第一介电层设置在基板上。 第一结构部分设置在第一电介质层上并具有第一侧壁。 第二结构部分设置在第一结构部分上并且具有第二侧壁。 第三结构部分设置在第二结构部分上并具有N个侧壁。 第二侧壁比第一侧壁更突出。 第一侧壁，第二侧壁和N侧壁限定第一蚀刻部分，并且第一电介质层的一部分从第一蚀刻部分露出。 第一导电焊盘设置在第一蚀刻部分中。 第二导体设置在第二电介质层上，覆盖第二电介质的一部分并暴露第一蚀刻部分的开口。