-
公开(公告)号：US20230156911A1
公开(公告)日：2023-05-18
申请号：US17798866
申请日：2021-02-09
Applicant: TOHOKU UNIVERSITY
Inventor： Shuji TANAKA , Takashiro TSUKAMOTO
CPC classification number: H05K1/028 , H05K1/0237 , H02N1/006 , H02K41/0354 , H04N23/687 , H04M1/0264 , H04N23/54 , H05K2201/10151 , H05K2201/052 , H04M2250/52
Abstract: A driving system (7) includes an actuator (71A) that performs at least one among translations in three directions orthogonal to one another and rotations about axes in the three directions, and a flexible wiring body (73A) that connects a semiconductor element (6) moving along with the actuator (71A) and a frame (72) positioned outer than the semiconductor element (6). The flexible wiring body (73A) is provided with a main part (731A) mounted with the semiconductor element (6) and electrically connected to the semiconductor element (6), and a plurality of arm parts (732A) extending from the main part (731A) toward the frame (72) and bent three-dimensionally.
-
公开(公告)号：US20210229985A1
公开(公告)日：2021-07-29
申请号：US16972409
申请日：2019-05-22
Applicant: TOHOKU UNIVERSITY
Inventor： Yukio SUZUKI , Shuji TANAKA , Takashiro TSUKAMOTO
Abstract: A MEMS device manufacturing method and a MEMS device are provided which can enhance a degree of vacuum inside an operation space and reduce the installation cost and maintenance cost of a manufacturing apparatus as well as manufacturing cost. A MEMS device includes a MEMS device wafer having an operation element formed on a Si substrate, and a CAP wafer provided to cover the MEMS device wafer to form an operation space for operably accommodating the operation element. The CAP wafer is made of silicon and includes vent holes formed to communicate with the operation space. The operation space is sealed by performing a heat treatment in a hydrogen gas atmosphere to close the vent holes by silicon surface migration of the CAP wafer with the CAP wafer and the MEMS device wafer bonded.
-
Search Results
2
records
(took 0.01 seconds)
