公开(公告)号：US11998955B2

公开(公告)日：2024-06-04

申请号：US17766651

申请日：2020-09-04

Applicant: TOKUYAMA CORPORATION

Inventor： Junya Sakai ,  Takuya Yokose

IPC: B08B3/04 ,  B08B13/00 ,  C01B33/02 ,  C01B33/021 ,  C01B33/037

CPC classification number: B08B3/04 ,  B08B13/00 ,  C01B33/02 ,  C01B33/021 ,  C01B33/037

Abstract: A device is provided which is capable of evenly etching the entire surface of a silicon core wire. An etching device (1) for a silicon core wire (C1, C2, C3) includes: an etching bath (11, 12) for holding an etching solution (L1, L2); and a plurality of core wire support members (31) for supporting the silicon core wire (C1, C2, C3), the plurality of core wire support members (31) each having a hole (31A) through which the silicon core wire (C1, C2, C3) is to pass; and a position change mechanism (40) for changing a relative position where the silicon core wire (C1, C2, C3) passes through in relation to the hole (31A).