公开(公告)号：US20230420156A1

公开(公告)日：2023-12-28

申请号：US18208068

申请日：2023-06-09

Applicant: TOPPAN INC.

Inventor： Hiroyoshi NISHIYAMA ,  Ryo SHODA

IPC: H01B3/00 ,  H05K9/00

CPC classification number: H01B3/002 ,  H05K9/0081

Abstract: A manufacturing method for manufacturing a dielectric layer included in a reflective electromagnetic wave absorber, the method including the steps of: preparing a resin composition containing at least one dielectric compound and a resin component, and having a relative permittivity higher than 10.0 at a frequency of 3.7 GHz or 90 GHz; and forming a dielectric layer made from this resin composition and having a thickness of 20 to 7000 μm. A resin composition according to the present disclosure is used to form a dielectric layer included in a reflective electromagnetic wave absorber, the resin composition containing at least one dielectric compound and a resin component, and having a relative permittivity higher than 10.0 at a frequency of 3.7 GHz or 90 GHz.

公开(公告)号：US20230202143A1

公开(公告)日：2023-06-29

申请号：US18118369

申请日：2023-03-07

Applicant: TOPPAN INC.

Inventor： Hiroyoshi NISHIYAMA ,  Ryo SHODA

IPC: B32B17/06 ,  B32B27/06 ,  C09D165/00

CPC classification number: B32B17/06 ,  B32B27/06 ,  C09D165/00 ,  B32B2255/26 ,  B32B2255/10 ,  B32B27/36

Abstract: A method for producing an organic conductive film includes a step of preparing a coating liquid containing an acid-based organic conductive polymer, an alkali neutralizing agent, and a liquid medium, and having a pH of 4.0 to 6.5 at 25° C., a step of applying the coating liquid to a base layer, and a step of removing the liquid medium from the applied coating liquid.

公开(公告)号：US20240040758A1

公开(公告)日：2024-02-01

申请号：US18199338

申请日：2023-05-18

Applicant: TOPPAN INC.

Inventor： Ryo SHODA ,  Hiroyoshi NISHIYAMA ,  Miho IMAI ,  Junya TANABE ,  Takeshi IKEDA

IPC: H05K9/00 ,  B32B27/32 ,  B32B27/36 ,  B32B27/08 ,  E04B1/92

CPC classification number: H05K9/0081 ,  H05K9/0003 ,  B32B27/32 ,  B32B27/36 ,  B32B27/08 ,  E04B1/92 ,  B32B2255/26 ,  B32B2264/102 ,  B32B2255/10 ,  B32B2307/212 ,  B32B2255/205 ,  B32B2419/00

Abstract: A designed electromagnetic wave suppressor includes a design layer, and an electromagnetic wave suppressor having an electromagnetic wave return attenuation of 10 dB or more. A building material includes the designed electromagnetic wave suppressor. An electromagnetic wave suppression chamber includes a room in which at least part of the inner walls is covered with the building material, and a transmitter disposed in the room. A system includes the electromagnetic wave suppression chamber, and a wireless communication device disposed in the electromagnetic wave suppression chamber.