公开(公告)号：US20240040758A1

公开(公告)日：2024-02-01

申请号：US18199338

申请日：2023-05-18

Applicant: TOPPAN INC.

Inventor： Ryo SHODA ,  Hiroyoshi NISHIYAMA ,  Miho IMAI ,  Junya TANABE ,  Takeshi IKEDA

IPC: H05K9/00 ,  B32B27/32 ,  B32B27/36 ,  B32B27/08 ,  E04B1/92

CPC classification number: H05K9/0081 ,  H05K9/0003 ,  B32B27/32 ,  B32B27/36 ,  B32B27/08 ,  E04B1/92 ,  B32B2255/26 ,  B32B2264/102 ,  B32B2255/10 ,  B32B2307/212 ,  B32B2255/205 ,  B32B2419/00

Abstract: A designed electromagnetic wave suppressor includes a design layer, and an electromagnetic wave suppressor having an electromagnetic wave return attenuation of 10 dB or more. A building material includes the designed electromagnetic wave suppressor. An electromagnetic wave suppression chamber includes a room in which at least part of the inner walls is covered with the building material, and a transmitter disposed in the room. A system includes the electromagnetic wave suppression chamber, and a wireless communication device disposed in the electromagnetic wave suppression chamber.