COATING PATTERN FORMATION METHOD, COATING PATTERN FORMATION DEVICE, AND COATING-PATTERNED SUBSTRATE

    公开(公告)号:US20190160483A1

    公开(公告)日:2019-05-30

    申请号:US16313190

    申请日:2017-06-22

    Abstract: A coating pattern formation method includes adjusting lyophilicity of a pattern region provided on a substrate, and forming a coating pattern having a shape of the pattern region by applying a coating liquid to the pattern region after the adjusting of the lyophilicity of the pattern region. The lyophilicity of the pattern region is adjusted such that the pattern region is divided into a plurality of small pattern regions in at least one division direction, such that adjacent small pattern regions have different lyophilicity, such that a small pattern region spaced away from an end of the pattern region has the lowest lyophilicity among the small pattern regions in the at least one division direction, and such that the lyophilicity of the small pattern regions increases from the small pattern region having the lowest lyophilicity toward the end of the pattern region.

    COATING DEVICE AND COATING METHOD
    2.
    发明申请

    公开(公告)号:US20190193103A1

    公开(公告)日:2019-06-27

    申请号:US16232161

    申请日:2018-12-26

    Inventor: Satoshi TOMOEDA

    CPC classification number: B05C5/02 B05D1/26

    Abstract: A coating device includes a nozzle, a pressure wave imparting component, and a controller. For each discharge of the coating liquid, the controller causes the pressure wave imparting component to perform a shaking operation that generates a pressure wave in the coating liquid inside the nozzle to an extent that a droplet is not discharged from the nozzle and the coating liquid is shaken in the nozzle, and a discharge operation that generates a pressure wave in the coating liquid inside the nozzle to an extent that a droplet is discharged from the nozzle after the shaking operation. The drive of the pressure wave imparting component in the shaking operation and the drive of the pressure wave imparting component in the discharge operation are kept constant, and a waiting time between the shaking operation and the discharge operation is adjusted.

    COATING METHOD
    3.
    发明申请
    COATING METHOD 审中-公开

    公开(公告)号:US20180339308A1

    公开(公告)日:2018-11-29

    申请号:US15757773

    申请日:2016-09-08

    Abstract: A coating method includes providing a substrate with a pattern region, and coating the pattern region entirely with a coating liquid to form a coating pattern. An area around the pattern region has lower lyophilicity than the pattern region. The pattern region has a lyophobic part whose lyophilicity is lower than that of a portion of the pattern region other than the lyophobic part within the pattern region.

    CONTINUOUS COATING DEVICE AND CONTINUOUS COATING METHOD

    公开(公告)号:US20200298270A1

    公开(公告)日:2020-09-24

    申请号:US16086099

    申请日:2017-03-28

    Abstract: A continuous coating device for continuously conveying a long film includes a coating roll, an imaging device and a coating head. The long film is wound onto the coating roll. The imaging device is configured to capture an image of a mark or a pattern on the long film wound onto the coating roll. The coating head is configured to coat the long film wound onto the coating roll with a specific pattern. The coating head is disposed downstream from the imaging device in a conveyance direction of the long film.

    INKJET HEAD MAINTENANCE DEVICE AND INKJET HEAD MAINTENANCE METHOD

    公开(公告)号:US20190016141A1

    公开(公告)日:2019-01-17

    申请号:US16067668

    申请日:2016-12-26

    Abstract: An inkjet head maintenance device includes a base, a liquid supplier and a liquid collector. The base has an upper face disposed closely opposite a nozzle face of an inkjet head to form a liquid reservoir space during maintenance of the inkjet head. The base includes a liquid supply hole and a liquid collection hole that open to the upper face. The liquid supplier is configured to supply liquid from the liquid supply hole to the liquid reservoir space. The liquid collector is configured to collect the liquid in the liquid reservoir space from the liquid collection hole.

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