公开(公告)号：US20220155684A1

公开(公告)日：2022-05-19

申请号：US17442236

申请日：2020-03-18

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki KATSURADA ,  Tomotaka KAWANO ,  Daisuke KANAMORI

IPC: G03F7/038 ,  G03F7/40 ,  G03F7/20 ,  G03F7/32

Abstract: A photosensitive resin composition according to the present invention is a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, (d-1) a photobleaching photopolymerization initiator having the structure represented by general formula (1), and (d-2) a photopolymerization initiator having the structure represented by general formula (1) and having a molar extinction coefficient at a wavelength of 405 nm of at least 1000 L/(mol·cm). (In general formula (1), R1 represents a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, —NR3R4, C1-20 monovalent hydrocarbon group, C1-20 acyl group, or C1-20 alkoxy group, and R3 and R4 each independently represent a hydrogen atom or C1-10 alkyl group, provided that at least a portion of the hydrogen atoms in the hydrocarbon group, acyl group, and alkoxy group may be substituted by a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, or —NR3R4, and a hydrocarbon group present in the hydrocarbon group, in the acyl group, or in the alkoxy group may be interrupted by an ether bond, thioether bond, ester bond, thioester bond, amide bond, or urethane bond. R2 represents a C1-5 alkyl group. The symbol * in the formula indicates bonding with a neighboring group via the * moiety.) The photosensitive resin composition according to the present invention is also a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, and (d) at least two species of oxime ester-type photopolymerization initiators. The photosensitive resin composition according to the present invention enables a high-sensitivity, high-quality photographic patterning of the cap portion of a hollow structure. A photosensitive resin sheet that uses the photosensitive resin composition according to the present invention is useful for application to the cap of the hollow structure of an electronic component that includes a hollow structure.

公开(公告)号：US20200019060A1

公开(公告)日：2020-01-16

申请号：US16494670

申请日：2018-03-12

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki KATSURADA ,  Daisuke KANAMORI

IPC: G03F7/038

Abstract: A photosensitive resin composition contains an alkali-soluble polyimide (a), an unsaturated bond-containing compound (b), a heat-crosslinkable compound (c), and a photopolymerization initiator (d) having a structure represented by the following general formula (1): wherein, R1 to R3 each independently represents a halogen atom, a hydroxy group, a carboxy group, a nitro group, a cyano group, —NR13R14, a monovalent hydrocarbon group having a carbon number of 1 to 20, an acyl group having a carbon number of 1 to 20, or an alkoxy group having a carbon number of 1 to 20; R13 and R14 each independently represents a hydrogen atom or an alkyl group having a carbon number of 1 to 10; R15 represents an alkyl group having a carbon number of 1 to 5; a represents an integer of 0 to 5 and b represents an integer of 0 to 4; and A represents CO or a direct bond.

公开(公告)号：US20160340558A1

公开(公告)日：2016-11-24

申请号：US15111265

申请日：2015-01-09

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takuro ODA ,  Daisuke KANAMORI ,  Toshihisa NONAKA

IPC: C09J9/02 ,  C08G73/10 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  C09J163/00 ,  C09J7/02

CPC classification number: C09J9/02 ,  C08G73/106 ,  C08G2170/00 ,  C09D163/00 ,  C09J7/20 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/00 ,  C09J2479/08 ,  H01L21/6836 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H05K3/321 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08L1/00 ,  H01L2924/07025 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/05032 ,  H01L2924/0498 ,  H01L2924/01026 ,  H01L2924/053 ,  H01L2924/049 ,  H01L2924/0544 ,  H01L2924/01006

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

Abstract translation: 本发明提供一种具有优异的破裂强度的粘合剂组合物，其特征在于含有聚酰亚胺（A），多官能环氧化合物（B），环氧固化剂（C）和无机颗粒（D） ，非挥发性有机成分中的聚酰亚胺（A）的比例为3.0重量％以上且30重量％以下，非挥发性有机成分中的环氧固化剂（C）的比例为0.5重量％以上且10重量％以下 重量％以下，T / M为400以上且8000以下，其中，T为非挥发性有机成分的总克数，M为非挥发性有机成分中的环氧基的摩尔数。

公开(公告)号：US20160300810A1

公开(公告)日：2016-10-13

申请号：US15038266

申请日：2014-11-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Daisuke KANAMORI ,  Takuro ODA ,  Toshihisa NONAKA

IPC: H01L23/00 ,  C08G73/10 ,  C09J163/00 ,  C09J7/02 ,  H01L21/683 ,  C09J9/02

CPC classification number: H01L24/29 ,  C08G73/1017 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/106 ,  C08G73/1064 ,  C08G73/1071 ,  C08G73/1082 ,  C08K3/36 ,  C08L21/00 ,  C08L63/00 ,  C09D179/08 ,  C09J7/20 ,  C09J9/02 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/00 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2224/2929

Abstract: The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.

Abstract translation: 本发明的目的是获得具有足够低的固化产物线性膨胀系数以及无机颗粒沿其制备的半固化膜的膜厚方向的均匀分布的半导体树脂组合物。 包含（a）环氧化合物，（b）无机颗粒，（c）聚酰亚胺和（d）溶剂）的半导体树脂组合物的特征在于还含有（e）橡胶颗粒和（ b）由半导体树脂组合物的总重量减去（d）溶剂的重量而得到的总固体成分重量为60-92wt％的无机颗粒。