公开(公告)号：US20180281361A1

公开(公告)日：2018-10-04

申请号：US15767552

申请日：2016-10-24

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takuro ODA ,  Shinji ARIMOTO ,  Takenori FUJIWARA

IPC: B32B27/08 ,  B32B27/28 ,  C09J183/04 ,  C09J179/08 ,  C09J11/04 ,  C09J7/22

Abstract: The present invention provides a laminate film for temporary bonding which is excellent in heat resistance, capable of providing a flat film even at the periphery of a substrate, and capable of making a semiconductor circuit formation substrate and a support substrate or a support film layer adhere to each other with one type of adhesive, and which can be peeled off at room temperature under mild conditions. The present invention provides a laminate film for temporary bonding, including at least three layers of (A) a protective film layer, (B) an adhesive layer, and (C) a support film layer, wherein the adhesive layer (B) contains at least a siloxane polymer represented by a specific general formula or a compound represented by a specific general formula.

公开(公告)号：US20160340558A1

公开(公告)日：2016-11-24

申请号：US15111265

申请日：2015-01-09

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takuro ODA ,  Daisuke KANAMORI ,  Toshihisa NONAKA

IPC: C09J9/02 ,  C08G73/10 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  C09J163/00 ,  C09J7/02

CPC classification number: C09J9/02 ,  C08G73/106 ,  C08G2170/00 ,  C09D163/00 ,  C09J7/20 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/00 ,  C09J2479/08 ,  H01L21/6836 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H05K3/321 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08L1/00 ,  H01L2924/07025 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/05032 ,  H01L2924/0498 ,  H01L2924/01026 ,  H01L2924/053 ,  H01L2924/049 ,  H01L2924/0544 ,  H01L2924/01006

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

Abstract translation: 本发明提供一种具有优异的破裂强度的粘合剂组合物，其特征在于含有聚酰亚胺（A），多官能环氧化合物（B），环氧固化剂（C）和无机颗粒（D） ，非挥发性有机成分中的聚酰亚胺（A）的比例为3.0重量％以上且30重量％以下，非挥发性有机成分中的环氧固化剂（C）的比例为0.5重量％以上且10重量％以下 重量％以下，T / M为400以上且8000以下，其中，T为非挥发性有机成分的总克数，M为非挥发性有机成分中的环氧基的摩尔数。

公开(公告)号：US20160300810A1

公开(公告)日：2016-10-13

申请号：US15038266

申请日：2014-11-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Daisuke KANAMORI ,  Takuro ODA ,  Toshihisa NONAKA

IPC: H01L23/00 ,  C08G73/10 ,  C09J163/00 ,  C09J7/02 ,  H01L21/683 ,  C09J9/02

CPC classification number: H01L24/29 ,  C08G73/1017 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/106 ,  C08G73/1064 ,  C08G73/1071 ,  C08G73/1082 ,  C08K3/36 ,  C08L21/00 ,  C08L63/00 ,  C09D179/08 ,  C09J7/20 ,  C09J9/02 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/00 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2224/2929

Abstract: The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.

Abstract translation: 本发明的目的是获得具有足够低的固化产物线性膨胀系数以及无机颗粒沿其制备的半固化膜的膜厚方向的均匀分布的半导体树脂组合物。 包含（a）环氧化合物，（b）无机颗粒，（c）聚酰亚胺和（d）溶剂）的半导体树脂组合物的特征在于还含有（e）橡胶颗粒和（ b）由半导体树脂组合物的总重量减去（d）溶剂的重量而得到的总固体成分重量为60-92wt％的无机颗粒。