公开(公告)号：US20240176239A1

公开(公告)日：2024-05-30

申请号：US18282909

申请日：2022-03-15

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kenta AOSHIMA ,  Yutaro KOYAMA ,  Kazuyuki MATSUMURA ,  Hitoshi ARAKI

IPC: G03F7/037 ,  C08G69/26 ,  C08G73/10 ,  C08G73/22

CPC classification number: G03F7/037 ,  C08G69/26 ,  C08G73/1053 ,  C08G73/22

Abstract: It is intended to provide a negative type photosensitive resin composition that ensures high aspect ratio pattern processability, high storage stability, and high curability and also provides a cured product with good mechanical characteristics and high heat resistance. A negative type photosensitive resin composition comprising a polymer compound (A), a cationic polymerizable compound (B), a cationic polymerization initiator (C), and a solvent (D) wherein the component (A) contains at least one compound selected from the group consisting of polyamide, polyimide, polybenzoxazole, precursors thereof, and copolymers thereof and wherein both the relations 0.6A≤B+0.5C≤0.98A and 0.05(B+C)≤C≤0.25(B+C) are satisfied where A (moles), B (moles), and C (moles) represent the quantities of all carboxylic acid residues, all diamine residues, and all monoamine residues, respectively, contained in the component (A).

公开(公告)号：US20240186172A1

公开(公告)日：2024-06-06

申请号：US18284195

申请日：2022-03-23

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yukari ARIMOTO ,  Risano NAKAJIMA ,  Mika KOSHINO ,  Hitoshi ARAKI ,  Masao TOMIKAWA ,  Takenori FUJIWARA ,  Kenta AOSHIMA

IPC: H01L21/683 ,  C08K5/00

CPC classification number: H01L21/6835 ,  C08K5/0025 ,  C08K5/0041 ,  H01L2221/68381

Abstract: Provided is a laminate that allows semiconductor elements to be transferred over a wide range of processing margins using lasers of various wavelengths, without damaging the elements or leaving behind any pasty residue. This laminate is a substrate in which a laser-transmitting substrate 1, a resin film, and a semiconductor element are laminated in the stated order. The absorbance of the resin film at a wavelength of 248 nm, 266 nm, or 355 nm expressed in terms of a film thickness of 1.0 μm us 0.4-5.0, and the adhesive strength of the resin film with respect to the semiconductor elements is 0.02-0.3 N/cm.

公开(公告)号：US20240166556A1

公开(公告)日：2024-05-23

申请号：US18284107

申请日：2022-03-23

Applicant: TORAY INDUSTRIES, INC.

Inventor： Risano NAKAJIMA ,  Yukari ARIMOTO ,  Mika KOSHINO ,  Hitoshi ARAKI ,  Masao TOMIKAWA ,  Takenori FUJIWARA ,  Kenta AOSHIMA

IPC: C03C17/34 ,  H01L25/075

CPC classification number: C03C17/3405 ,  H01L25/0753 ,  C03C2217/78 ,  C03C2218/116 ,  C03C2218/32

Abstract: Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The laminate is obtained by laminating a substrate 1 having laser permeability, a resin film 1 and a resin film 2 in this order, wherein the light absorbance of the resin film 1 calculated for a film thickness of 1.0 μm at any wavelength of 200 nm to 1100 nm is 0.4-5.0, and the adhesive strength of the surface of the resin film 2 on the side opposite that of the resin film 1 side is 0.02-0.3 N/cm.