公开(公告)号：US20240176239A1

公开(公告)日：2024-05-30

申请号：US18282909

申请日：2022-03-15

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kenta AOSHIMA ,  Yutaro KOYAMA ,  Kazuyuki MATSUMURA ,  Hitoshi ARAKI

IPC: G03F7/037 ,  C08G69/26 ,  C08G73/10 ,  C08G73/22

CPC classification number: G03F7/037 ,  C08G69/26 ,  C08G73/1053 ,  C08G73/22

Abstract: It is intended to provide a negative type photosensitive resin composition that ensures high aspect ratio pattern processability, high storage stability, and high curability and also provides a cured product with good mechanical characteristics and high heat resistance. A negative type photosensitive resin composition comprising a polymer compound (A), a cationic polymerizable compound (B), a cationic polymerization initiator (C), and a solvent (D) wherein the component (A) contains at least one compound selected from the group consisting of polyamide, polyimide, polybenzoxazole, precursors thereof, and copolymers thereof and wherein both the relations 0.6A≤B+0.5C≤0.98A and 0.05(B+C)≤C≤0.25(B+C) are satisfied where A (moles), B (moles), and C (moles) represent the quantities of all carboxylic acid residues, all diamine residues, and all monoamine residues, respectively, contained in the component (A).

公开(公告)号：US20220289976A1

公开(公告)日：2022-09-15

申请号：US17639626

申请日：2020-09-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hisashi OGASAWARA ,  Akira SHIMADA ,  Kazuyuki MATSUMURA ,  Yohei SAKABE ,  Hitoshi ARAKI ,  Masaya JUKEI

IPC: C08L79/08 ,  C08L63/00 ,  C08L71/12 ,  C08L83/06 ,  C08L83/16

Abstract: Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)-(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and/or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a+b=6-17 and c+d=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e+f=5-16 and g+h=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500-5,000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.

公开(公告)号：US20160083537A1

公开(公告)日：2016-03-24

申请号：US14783641

申请日：2014-05-30

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yoichi SHIMBA ,  Kazuyuki MATSUMURA ,  Toshihisa NONAKA

IPC: C08J5/18 ,  C08K5/07 ,  B29C41/02 ,  C08K9/04 ,  H01L21/50 ,  H01L23/00

CPC classification number: C08J5/18 ,  B29C41/02 ,  B29K2063/00 ,  B29K2105/16 ,  B29K2509/00 ,  C08J2363/00 ,  C08K3/013 ,  C08K5/07 ,  C08K9/04 ,  H01L21/50 ,  H01L21/6836 ,  H01L23/49558 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2021/603 ,  H01L2221/68327 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3512 ,  H05K3/305 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  C08K3/0033 ,  C08L63/00

Abstract: Provided is a resin sheet, wherein in a stress measurement in which a dynamic shear strain is applied in a direction parallel to a surface, the difference between a loss tangent as measured when a strain amplitude is 10% of the sheet thickness and a loss tangent as measured when the amplitude is 0.1% is equal to or greater than 1 at a temperature of 80° C. and a frequency of 0.5 Hz. The resin sheet of the present invention can provide a semiconductor device with excellent connection reliability, wherein air bubbles and cracks are less likely to occur in the resin sheet. In the resin composition of the present invention, aggregates are less likely to occur during storage. The resin sheet obtained by forming the resin composition into a sheet has good flatness. The hardened material thereof can provide a circuit board or a semiconductor device with high connection reliability.

Abstract translation: 提供一种树脂片，其中在应力测量中，在与表面平行的方向上施加动态剪切应变时，在应变幅度为板厚的10％时测量的损耗角正切与损耗角正切之间的差 当在80℃的温度和0.5Hz的频率下振幅为0.1％时测得的值等于或大于1。 本发明的树脂片可以提供具有良好的连接可靠性的半导体器件，其中在树脂片中不太可能发生气泡和裂纹。 在本发明的树脂组合物中，聚集体在储存期间不太可能发生。 通过将树脂组合物形成为片材而获得的树脂片具有良好的平坦度。 其硬化材料可以提供具有高连接可靠性的电路板或半导体器件。

公开(公告)号：US20220372288A1

公开(公告)日：2022-11-24

申请号：US17762900

申请日：2020-08-27

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuyuki MATSUMURA ,  Yoshiko TATEOKA ,  Akira SHIMADA

IPC: C08L77/06 ,  C08L79/08 ,  C08J5/18 ,  C08L63/00

Abstract: In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, in which (A) the polymer compound has a carboxylic acid residue at a molecular chain terminal.