公开(公告)号：US20220372288A1

公开(公告)日：2022-11-24

申请号：US17762900

申请日：2020-08-27

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuyuki MATSUMURA ,  Yoshiko TATEOKA ,  Akira SHIMADA

IPC: C08L77/06 ,  C08L79/08 ,  C08J5/18 ,  C08L63/00

Abstract: In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, in which (A) the polymer compound has a carboxylic acid residue at a molecular chain terminal.