公开(公告)号：US20250066651A1

公开(公告)日：2025-02-27

申请号：US18687156

申请日：2022-09-08

Applicant: TOYOBO MC Corporation

Inventor： Hiroyuki MIEDA ,  Koichi SAKAMOTO ,  Tadahiko MIKAMI

IPC: C09J167/02 ,  C09J7/30 ,  H05K1/03

Abstract: The adhesive resin composition according to the present invention is characterized by containing a polyester resin (A) and satisfying: (i) the polyester resin (A) has an acid value of 100 eq/ton or more; (ii) the polyester resin (A) contains, as polyol components constituting the polyester resin (A), a diol (a) having two primary hydroxy groups and having no alicyclic structure, and either one or both of a diol (b) having an alicyclic structure and a diol (c) having one primary hydroxy group and one secondary hydroxy group and having no alicyclic structure; and (iii) the polyester resin (A) contains, as polycarboxylic acid components constituting the polyester resin (A), an unsaturated dicarboxylic acid (d). The adhesive resin composition according to the present invention enables curing even if the adhesive resin composition contains substantially no curing agent and therefore has excellent properties such as high solder heat resistance and adhesiveness to various base materials. The present invention also provides a laminate or an adhesive sheet comprising an adhesive layer made from the adhesive resin composition, a printed-wiring board or a packing material comprising the laminate as a constituent element, and a laminated film for decorating three-dimensional molded article or a film for laminating metal can comprising the adhesive sheet as a constituent element.

公开(公告)号：US20250122412A1

公开(公告)日：2025-04-17

申请号：US18685313

申请日：2022-09-08

Applicant: TOYOBO MC Corporation

Inventor： Hiroyuki MIEDA ,  Koichi SAKAMOTO ,  Tadahiko MIKAMI

IPC: C09J167/02 ,  C08G63/183 ,  C08G63/189 ,  C08G63/199 ,  C08G63/52

Abstract: An adhesive resin composition according to the present invention is characterized by containing a polyester resin (A) and satisfying: (i) the polyester resin (A) has an acid value of 100 eq/ton or more; (ii) the adhesive resin composition contains substantially no curing agent; and (iii) the polyester resin (A) contains, as polyol components constituting the polyester resin (A), a diol (a) having two primary hydroxy groups and having no alicyclic structure, and either one or both of a diol (b) having an alicyclic structure and a diol (c) having one primary hydroxy group and one secondary hydroxy group and having no alicyclic structure. The adhesive resin composition according to the present invention has good pot life property, and has excellent solder heat resistance and adhesiveness to various base materials, even with use of substantially no curing agent. The present invention also provides a laminate or an adhesive sheet comprising an adhesive layer made from the adhesive resin composition, a printed-wiring board or a packing material comprising the laminate as a constituent element, and a laminated film for decorating three-dimensional molded article or a film for laminating metal can comprising the adhesive sheet as a constituent element.