公开(公告)号：US20230003582A1

公开(公告)日：2023-01-05

申请号：US17687908

申请日：2022-03-07

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： HSIN-YEN HSU ,  YE-QUANG CHEN ,  HO-KAI LIANG ,  YI-MOU HUANG ,  JIAN-ZONG LIU

IPC: G01J3/45 ,  G01J3/02

Abstract: An optical module includes a micro spectrometer. The micro spectrometer includes an optical crystal, a lens, and a photosensitive assembly. The optical crystal is configured to receive detection light and covert the detection light into interference light. The optical crystal is surrounded by a sleeve, the sleeve configured to fix a position of the optical crystal. The lens is configured for receiving the interference light and focusing the interference light. The photosensitive assembly is configured for imaging the interference light into an interference image. The optical module further comprises a controller. The controller is electrically connected to the photosensitive assembly, and the controller is used to convert the interference image into light wavelength signals and light intensity signals.

公开(公告)号：US20230309237A1

公开(公告)日：2023-09-28

申请号：US17993484

申请日：2022-11-23

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： HSIN-YEN HSU

IPC: H05K1/18 ,  H05K1/14 ,  H01L27/146

CPC classification number: H05K1/189 ,  H05K1/142 ,  H01L27/14625 ,  H01L27/14618 ,  H01L27/14636 ,  H05K2201/058 ,  H05K2201/2009 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A packaging structure includes a flexible circuit board, an image sensor, a reinforcing plate, and an adhesive layer. The flexible circuit board defines a first opening, a first connecting portion, and a second connecting portion. The image sensor includes a photosensitive area exposed in the first opening and a connection area electrically coupled with the first connecting portion through a conductive body. The reinforcing plate and the image sensor are located on a same side of the flexible circuit board. The adhesive layer covers edges of the image sensor and couples the image sensor to the flexible circuit board. A lens module and an electronic device comprising the packaging structure are also disclosed.

公开(公告)号：US20220020809A1

公开(公告)日：2022-01-20

申请号：US17378472

申请日：2021-07-16

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： HSIN-YEN HSU

IPC: H01L27/146

Abstract: A packaging structure for an image sensor used in an electronic device includes a flexible circuit board, a reinforcing plate, an image sensor, and an adhesive layer. The reinforcing plate is disposed on the flexible circuit board. The image sensor is disposed in the reinforcing plate. The adhesive layer bonds the flexible circuit board, the reinforcing plate, the image sensor and the conductor.